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XC3S1000-4FGG320C
IC FPGA 221 I/O 320FBGA
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Spezifikationen
| Series | Spartan®-3 |
| Part Status | Obsolete |
| Base Product Number | XC3S1000 |
| DigiKey Programmable | Not Verified |
| Number of LABs/CLBs | 1920 |
| Number of Logic Elements/Cells | 17280 |
| Total RAM Bits | 442368 |
| Number of I/O | 221 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | 320-BGA |
| Supplier Device Package | 320-FBGA (19x19) |
| Packaging | Tray |
| Number of Gates | 1000000 |
Übersicht
Description
With a 320-ball Fine Pitch Ball Grid Array (FBGA) package, it offers a compact form factor for space-constrained designs. The device comes with embedded block RAM, DSP slices for digital signal processing, and a rich set of configuration options. It is typically used in applications such as consumer electronics, automotive systems, and industrial automation, where flexibility and performance are crucial.
The XC3S1000 is programmable using the Xilinx ISE design suite, allowing designers to implement custom logic and functions tailored to specific projects. Its low power consumption and high integration capabilities make it a popular choice for embedded system designs.
Features
- Logic Cells: Offers approximately 1,000 logic cells, allowing for complex digital designs.
- Configuration Memory: Supports up to 1 Mbit of embedded memory.
- I/O Pins: Provides 320 user I/O pins with various voltage standards, suitable for interfacing with a wide range of peripherals.
- Clock Management: Features integrated clock management resources including DLLs (Delay-Locked Loops) and PLLs (Phase-Locked Loops).
- Performance: Operates at a maximum clock frequency of up to 200 MHz, depending on design complexity.
- Package: Comes in a 320-ball Fine Pitch Ball Grid Array (FBGA) package, facilitating compact designs.
- Power Consumption: Optimized for low power operation, suitable for battery-powered applications.
This FPGA is commonly used in applications such as digital signal processing, telecommunications, and embedded systems, offering flexibility and reconfigurability for diverse design requirements.
Package
Pinout
The functions of these pins can be categorized as follows:
1. I/O Pins: Used for general input/output operations, allowing interfacing with external devices.
2. Power Pins: Provide power supply to the FPGA, including VCC and GND pins.
3. Configuration Pins: Used for programming and configuring the FPGA, such as JTAG and PROM interface pins.
4. Clock Pins: Dedicated pins for clock signals to synchronize operations within the FPGA.
5. Signal Pins: Include dedicated pins for specific functions, such as global clock networks and high-speed serial interfaces.
The XC3S1000-4FGG320C is suitable for various applications, including digital signal processing, telecommunications, and embedded systems.
Manufacturer
Application
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Zahlungen
Payment Methods
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