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XC3S1000-4FGG320I
IC FPGA 221 I/O 320FBGA
- Hersteller
- Fr. Teil #XC3S1000-4FGG320I
- Paket FBGA-320
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Spezifikationen
| Package | Tray |
| Series | Spartan®-3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1920 |
| NumberofLogicElements/Cells | 17280 |
| TotalRAMBits | 442368 |
| NumberofI/O | 221 |
| NumberofGates | 1000000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 320-BGA |
Übersicht
Description
The "4" in its designation indicates a speed grade, with lower numbers corresponding to higher performance, while "FGG320" refers to its package type and pin count, which is a fine-pitch ball grid array (FBGA) with 320 balls. Its architecture supports advanced configuration options, allowing for quick reprogramming and prototyping of digital circuits. Typical applications include embedded systems, consumer electronics, and communication devices. Overall, the XC3S1000-4FGG320I is favored for its adaptability, moderate resource availability, and efficient power consumption, making it a popular choice among designers.
Features
1. Logic Cells: Approximately 1,000 logic cells, enabling a range of digital processing tasks.
2. Embedded Memory: Up to 576 Kbits of distributed RAM and support for block RAMs.
3. I/O Ports: 320 I/O pins with flexible I/O standards, supporting various voltage levels (3.3V, 2.5V, 1.8V).
4. Clock Management: Integrated Phase-Locked Loops (PLLs) for clock management and distribution.
5. Configuration: Multiple configuration options including JTAG, serial, and parallel modes.
6. Packages: Available in a 320-ball Fine Pitch Ball Grid Array (FBGA) package, optimizing space and thermal performance.
7. Development Tools: Compatible with Xilinx development tools such as ISE, enabling rapid prototyping and design debugging.
This FPGA is ideal for applications in communications, automotive, industrial, and consumer electronics.
Package
Pinout
The function of these pins includes:
- Power Supply Pins: For VCC and GND connections.
- I/O Pins: Configurable as input, output, or bidirectional for interfacing with external devices.
- Clock Pins: Dedicated pins for clock signals.
- Configuration Pins: Used for loading the configuration data into the FPGA.
- Special Function Pins: These may include JTAG pins for boundary scan and programming, as well as dedicated pins for internal functions like feedback loops.
The XC3S1000 is suitable for diverse applications such as communications, automotive, and industrial control systems, owing to its flexibility and programmable nature.
Manufacturer
Application
Equivalent
- Lattice Semiconductor's LatticeECP3 series
- Intel's Cyclone III series
- Microchip's IGLOO series
These alternatives offer similar performance and capabilities, suitable for applications requiring low power and cost-effective solutions. Always check specific features and compatibility for your application.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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