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XC3S1000-4FGG456C
IC FPGA 333 I/O 456FBGA
- Hersteller
- Fr. Teil #XC3S1000-4FGG456C
- Paket FBGA-456
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Spezifikationen
| Package | Tray |
| Series | Spartan®-3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1920 |
| NumberofLogicElements/Cells | 17280 |
| TotalRAMBits | 442368 |
| NumberofI/O | 333 |
| NumberofGates | 1000000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 456-BBGA |
Übersicht
Description
Key specifications include a maximum clock frequency of up to 200 MHz, 4,656 logic cells, and support for multiple I/O standards. The FPGA is housed in a compact Fine-Pitch Ball Grid Array (FBGA) package, promoting efficient thermal management and integration into dense electronic designs.
With its reprogrammable architecture, the XC3S1000 enables designers to iterate on their designs quickly, making it ideal for prototyping and low-volume production. The chip is commonly used in applications such as industrial automation, consumer electronics, and telecommunications. Overall, the XC3S1000-4FGG456C offers a cost-effective solution for developers requiring customization and flexibility in their hardware designs.
Features
1. Logic Cells: 1,000 configurable logic cells for implementing complex logic functions.
2. I/O Pins: Up to 456 I/O pins, supporting various voltage levels and I/O standards.
3. Speed Grade: Operates at a speed grade of -4, providing high performance for timing-critical applications.
4. Block RAM: Up to 64 Kbit of on-chip Block RAM for data storage and buffering.
5. DSP Slices: Incorporates DSP slices for efficient signal processing tasks.
6. Configuration: Supports multiple configuration methods, including JTAG, serial, and parallel programming.
7. Low Power: Designed for low power consumption, making it suitable for battery-operated devices.
8. Development Support: Compatible with Xilinx ISE design software, facilitating development and integration into systems.
These features make the XC3S1000-4FGG456C ideal for applications in communications, automotive, industrial control, and consumer electronics.
Package
Pinout
Key features include:
- Logic Cells: Approximately 1,000 logic cells for implementing custom logic functions.
- Memory: Includes block RAM and distributed RAM for data storage.
- I/O Ports: Supports various I/O standards and can operate at different voltage levels for flexibility in interfacing.
- Configuration: Can be configured to perform a wide array of tasks in applications such as telecommunications, automotive, industrial control, and consumer electronics.
Overall, the XC3S1000-4FGG456C is designed for cost-effective performance in a variety of electronic designs.
Manufacturer
Application
Equivalent
1. XC3S1000-4FGG456 (same chip without the 'C' temperature grade)
2. Lattice ECP3 series FPGAs (similar performance)
3. Altera Cyclone III series FPGAs (comparable features)
Always check specifications to ensure compatibility with your design requirements.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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