XC3S1000-4FGG456C

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XC3S1000-4FGG456C

IC FPGA 333 I/O 456FBGA

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  • Fr. Teil #XC3S1000-4FGG456C
  • Paket FBGA-456
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Spezifikationen

Package Tray
Series Spartan®-3
ProductStatus Active
NumberofLABs/CLBs 1920
NumberofLogicElements/Cells 17280
TotalRAMBits 442368
NumberofI/O 333
NumberofGates 1000000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 456-BBGA

Übersicht

Description

The XC3S1000-4FGG456C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3 family, designed for versatility in various digital applications. It features approximately 1,000 logic cells, allowing for a range of configurations suitable for tasks such as signal processing, control systems, and embedded applications. The device is fabricated using a 90nm process technology, ensuring a balance between performance and power efficiency.
Key specifications include a maximum clock frequency of up to 200 MHz, 4,656 logic cells, and support for multiple I/O standards. The FPGA is housed in a compact Fine-Pitch Ball Grid Array (FBGA) package, promoting efficient thermal management and integration into dense electronic designs.
With its reprogrammable architecture, the XC3S1000 enables designers to iterate on their designs quickly, making it ideal for prototyping and low-volume production. The chip is commonly used in applications such as industrial automation, consumer electronics, and telecommunications. Overall, the XC3S1000-4FGG456C offers a cost-effective solution for developers requiring customization and flexibility in their hardware designs.

Features

The XC3S1000-4FGG456C is a Spartan-3 FPGA (Field-Programmable Gate Array) from Xilinx, designed for cost-sensitive, high-performance applications. Key features include:
1. Logic Cells: 1,000 configurable logic cells for implementing complex logic functions.
2. I/O Pins: Up to 456 I/O pins, supporting various voltage levels and I/O standards.
3. Speed Grade: Operates at a speed grade of -4, providing high performance for timing-critical applications.
4. Block RAM: Up to 64 Kbit of on-chip Block RAM for data storage and buffering.
5. DSP Slices: Incorporates DSP slices for efficient signal processing tasks.
6. Configuration: Supports multiple configuration methods, including JTAG, serial, and parallel programming.
7. Low Power: Designed for low power consumption, making it suitable for battery-operated devices.
8. Development Support: Compatible with Xilinx ISE design software, facilitating development and integration into systems.
These features make the XC3S1000-4FGG456C ideal for applications in communications, automotive, industrial control, and consumer electronics.

Package

The XC3S1000-4FGG456C is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically a 456-ball configuration. This package type offers a compact design and efficient thermal management suitable for various applications in FPGA systems.

Pinout

The XC3S1000-4FGG456C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family. It has a pin count of 456. The primary functions of this FPGA include digital signal processing, logic implementation, and interfacing with various peripherals.
Key features include:
- Logic Cells: Approximately 1,000 logic cells for implementing custom logic functions.
- Memory: Includes block RAM and distributed RAM for data storage.
- I/O Ports: Supports various I/O standards and can operate at different voltage levels for flexibility in interfacing.
- Configuration: Can be configured to perform a wide array of tasks in applications such as telecommunications, automotive, industrial control, and consumer electronics.
Overall, the XC3S1000-4FGG456C is designed for cost-effective performance in a variety of electronic designs.

Manufacturer

The manufacturer of the XC3S1000-4FGG456C is Xilinx, Inc. Founded in 1984, Xilinx is a semiconductor company headquartered in San Jose, California. It is known for pioneering the field of field-programmable gate arrays (FPGAs), which allow users to configure hardware for specific applications after manufacturing. Xilinx's products are widely used in various industries, including telecommunications, automotive, aerospace, and consumer electronics, enabling high-performance computing, signal processing, and custom logic solutions. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further extending its capabilities in the semiconductor market.

Application

The XC3S1000-4FGG456C is a Spartan-3 FPGA used in various applications, including digital signal processing, embedded systems, telecommunications, automotive, and industrial control. It is ideal for applications requiring high-speed data processing, custom logic implementations, and real-time signal manipulation, thanks to its programmable architecture, low power consumption, and flexibility.

Equivalent

The XC3S1000-4FGG456C is a Spartan-3 FPGA from Xilinx. Equivalent products include:
1. XC3S1000-4FGG456 (same chip without the 'C' temperature grade)
2. Lattice ECP3 series FPGAs (similar performance)
3. Altera Cyclone III series FPGAs (comparable features)
Always check specifications to ensure compatibility with your design requirements.

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