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XC3S1500-4FGG320I
IC FPGA 221 I/O 320FBGA
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Spezifikationen
| Series | Spartan®-3 |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 29952 |
| Total RAM Bits | 589824 |
| Number of I/O | 221 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 320-BGA |
| Supplier Device Package | 320-FBGA (19x19) |
| Base Product Number | XC3S1500 |
| Number of LABs/CLBs | 3328 |
| Number of Gates | 1500000 |
Übersicht
Description
Key characteristics include a four-input look-up table (LUT) architecture, supporting a high degree of logic density and flexibility for implementing complex designs. The device operates at a core voltage of 1.2V and offers a range of I/O standards, facilitating compatibility with various interfaces.
The "FGG" denotes a fine-pitch, ball grid array package, providing efficient thermal performance and space-saving design, while the "320" refers to the number of pins. The XC3S1500 also supports a variety of development tools and languages, including VHDL and Verilog, enabling rapid prototyping and deployment. Its combination of performance, capacity, and low power consumption makes it a popular choice among engineers for diverse applications in the embedded systems and consumer electronics sectors.
Features
1. Logic Cells: 1,500 logic cells with configurable logic blocks.
2. I/O Pins: Supports up to 132 I/O pins, enabling versatile connectivity options.
3. Memory: Includes dedicated block RAM (up to 512 Kbits) for efficient data storage and manipulation.
4. Speed Grade: Operates at a maximum speed of 4.
5. Voltage: Designed for low-power operation with a supply voltage of 1.2V for the core and 3.3V for I/O.
6. Configurable: Supports a wide range of applications with customizable logic and interconnect resources.
7. Development Tools: Compatible with Xilinx ISE design tools, facilitating easy programming and implementation.
8. Package: Available in a 320-pin Fine Pitch Ball Grid Array (FBGA) package.
Ideal for cost-sensitive applications requiring moderate performance, such as consumer electronics, automotive, and communications.
Package
Pinout
The primary functions of this FPGA include digital signal processing, data manipulation, and various logic operations. It is designed for applications that require high performance, low power consumption, and flexibility, such as communications, automotive, industrial control, and consumer electronics. The device features multiple I/O standards, programmable interconnects, and on-chip memory resources, allowing for a wide range of custom hardware implementations.
The "-4" in the part number indicates the speed grade, while "I" denotes the industrial temperature range. Overall, the XC3S1500-4FGG320I is well-suited for complex designs needing both versatility and efficiency.
Manufacturer
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Zahlungen
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