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XC3S1500-4FGG456C
IC FPGA 333 I/O 456FBGA
- Hersteller
- Fr. Teil #XC3S1500-4FGG456C
- Paket 456-BBGA
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Spezifikationen
| Package | Tray |
| Series | Spartan®-3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 3328 |
| NumberofLogicElements/Cells | 29952 |
| TotalRAMBits | 589824 |
| NumberofI/O | 333 |
| NumberofGates | 1500000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 456-BBGA |
Übersicht
Description
This FPGA comes in a 456-pin Fine Pitch Ball Grid Array (FBGA) package, facilitating compact designs. It supports various I/O standards, including LVTTL, LVCMOS, and SSTL, making it versatile for different interfacing needs.
The device is well-suited for applications in consumer electronics, automotive, and industrial control systems. With a built-in configuration memory and support for JTAG programming, the XC3S1500 allows for easy programming and reconfiguration, enabling rapid prototyping and iterative design processes. Its power efficiency and performance scalability make it a popular choice among engineers and designers looking for a reliable and flexible solution.
Features
1. Logic Cells: Approximately 1,500 logic cells, providing a balance of performance and resource utilization.
2. Speed Grade: Rated at -4, offering a maximum clock frequency suitable for various applications.
3. I/O Pins: Supports up to 456 pins, allowing for flexible connectivity options.
4. Memory: Includes distributed RAM, block RAM, and support for external memory interfaces.
5. Configurable Architecture: Supports a variety of digital logic implementations, enhancing design flexibility.
6. Power Efficiency: Designed to operate with low power consumption, making it suitable for portable and battery-operated devices.
7. Development Tools: Compatible with Xilinx design tools such as ISE for ease of design and implementation.
These features make the XC3S1500-4FGG456C ideal for applications in consumer electronics, automotive systems, and industrial control.
Package
Pinout
The device supports various functions, including digital signal processing, high-speed data communication, and complex logic tasks. It provides a combination of programmable logic blocks, memory resources, and I/O pins, making it suitable for a wide range of applications in telecommunications, automotive, industrial control, and consumer electronics.
Additionally, it includes dedicated configurations for different I/O standards and can manage multiple voltage levels, enhancing its versatility in interfacing with different components.
Manufacturer
Application
Equivalent
1. XC3S1500-4FGG676C - Different package.
2. XC3S2000 - Higher capacity in Spartan-3 series.
3. Lattice MachXO2 - Similar low-power FPGA alternative.
4. Intel (Altera) Cyclone IV - Competitor with similar specifications.
Always verify specific requirements such as I/O count, power, and configuration capabilities.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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