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XC3S1600E-4FGG320I
IC FPGA 250 I/O 320FBGA
- Hersteller
- Fr. Teil #XC3S1600E-4FGG320I
- Paket BGA320
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Spezifikationen
| Package | Tray |
| Series | Spartan®-3E |
| ProductStatus | Active |
| NumberofLABs/CLBs | 3688 |
| NumberofLogicElements/Cells | 33192 |
| TotalRAMBits | 663552 |
| NumberofI/O | 250 |
| NumberofGates | 1600000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 320-BGA |
Übersicht
Description
The "-4" indicates the speed grade, while "FGG320" refers to the package type, which is a fine-pitch ball grid array (FBGA) with 320 balls, facilitating dense circuit layouts. The "I" at the end signifies that the device is industrial grade, capable of functioning in a wider temperature range for robust applications.
Common applications include digital signal processing, communications, and embedded systems, where flexibility and reconfigurability are essential. The XC3S1600E also supports various design tools, such as Xilinx ISE, enabling users to implement complex designs efficiently.
Features
- Logic Cells: 1.6 million system gates with 3,840 logic cells.
- I/O Pins: Up to 232 I/O pins, supporting various I/O standards.
- Memory: 18 Kb Block RAM, providing up to 4.5 Mbits of integrated memory.
- DSP Slices: Includes 8 DSP slices for efficient signal processing.
- Speed Grade: Operates at a speed grade of -4, ensuring high performance for time-sensitive applications.
- Configuration: Supports JTAG, SPI, and other configuration methods.
- Power Consumption: Low power consumption, suitable for battery-operated devices.
- Development Tools: Compatible with Xilinx ISE Design Suite for design and implementation.
This FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial control systems.
Package
Pinout
Key functions of the XC3S1600E include:
1. Logic Capacity: It has a logic cell count of 1,600, allowing for the implementation of complex designs.
2. I/O Capability: Supports multiple I/O standards, providing flexibility for interfacing with other devices.
3. Embedded Block RAM: Contains multiple kilobits of block RAM for data storage and processing.
4. DSP Slices: Equipped with DSP slices for efficient arithmetic operations.
5. Configuration Options: Supports several configuration modes, including JTAG and serial modes.
This FPGA is widely used in applications requiring high performance and flexibility.
Manufacturer
Xilinx plays a pivotal role in the electronics industry by providing solutions that enable designers to create customizable hardware and software systems. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further enhancing its capabilities in the field of high-performance computing and adaptive computing solutions.
Application
Equivalent
1. Lattice ECP3-70: Another FPGA family offering similar features.
2. Altera Cyclone III EP3C16: Comparable in logic density and performance.
3. Microsemi SmartFusion: A mixed-signal FPGA with similar capabilities.
When selecting alternatives, consider specific application requirements like I/O count, speed, and power consumption.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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