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XC3S1600E-5FGG320C
IC FPGA 250 I/O 320FBGA
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- Fr. Teil #XC3S1600E-5FGG320C
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Spezifikationen
| Series | Spartan®-3E |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 663552 |
| Number of I/O | 250 |
| Number of Gates | 1600000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 320-BGA |
| Supplier Device Package | 320-FBGA (19x19) |
| Base Product Number | XC3S1600 |
| Number of Logic Elements/Cells | 33192 |
| Number of LABs/CLBs | 3688 |
Übersicht
Description
This FPGA operates at a maximum clock frequency of 200 MHz and supports multiple I/O standards, making it suitable for various interfacing needs. The "5" in its designation indicates the speed grade, with lower numbers representing faster operation. The 320-pin Fine Pitch Ball Grid Array (FBGA) package offers a compact footprint for space-constrained designs.
Applications of the XC3S1600E include digital signal processing, industrial automation, communications, and consumer electronics. Its combination of reprogrammability, scalability, and performance makes it a popular choice for developers seeking to implement custom hardware solutions without the need for ASIC fabrication.
Features
1. Logic Cells: 1,600 logic cells for implementing complex logic functions.
2. Configurable I/O: Up to 88 I/O pins with support for various voltage standards.
3. Embedded Memory: 16 Kbit of block RAM for data storage and buffering.
4. Digital Signal Processing (DSP): Features 12 dedicated DSP slices for efficient signal processing tasks.
5. Clock Management: Provides multiple clock management resources, including phase-locked loops (PLLs).
6. Low Power Consumption: Designed for energy-efficient operation, making it suitable for battery-powered applications.
7. Development Tools: Compatible with Xilinx ISE Design Suite for design entry, simulation, and implementation.
8. Package: Available in a 320-pin fine-pitch BGA (FGG) package.
This FPGA is ideal for a range of applications, including communications, automotive, and industrial control systems, offering flexibility and scalability in design.
Package
Pinout
The primary functions of the pins include:
1. User I/O: General-purpose input/output pins for interfacing with external devices.
2. Configuration Pins: Pins used for device configuration and setup (e.g., TMS, TDI, TCK).
3. Power Supply Pins: Pins for supplying power (VCC, GND).
4. Clock Pins: Dedicated pins for clock inputs.
5. JTAG Pins: For in-circuit debugging and programming.
This FPGA is designed for various applications, including digital signal processing, embedded systems, and communication systems, providing flexibility in design and implementation.
Manufacturer
Application
Equivalent
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Zahlungen
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