XC3S200-4FTG256C

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XC3S200-4FTG256C

IC FPGA 173 I/O 256FTBGA

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Spezifikationen

Series Spartan®-3
Part Status Obsolete
DigiKey Programmable Not Verified
Number of Logic Elements/Cells 4320
Total RAM Bits 221184
Number of I/O 173
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 256-LBGA
Supplier Device Package 256-FTBGA (17x17)
Base Product Number XC3S200
Number of LABs/CLBs 480
Number of Gates 200000

Übersicht

Description

The XC3S200-4FTG256C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3 series. It features 200,000 system gates, making it suitable for a variety of applications including digital signal processing, embedded systems, and telecommunications. The device comes in a 256-pin Fine Pitch Ball Grid Array (FBGA) package, offering a compact solution for space-constrained designs.
Key features include 4-input lookup tables (LUTs), high-speed serial transceivers, and a rich set of I/O options. It operates with a core voltage of 1.2V and supports various programming methods, making it versatile for prototyping and production. The XC3S200 is known for its balance of performance, power efficiency, and cost-effectiveness, making it a popular choice among engineers for developing custom logic solutions. The Spartan-3 architecture also supports a wide range of development tools, facilitating ease of use for both beginners and experienced developers.

Features

The XC3S200-4FTG256C is a member of the Xilinx Spartan-3 family of FPGAs. Key features include:
- Logic Cells: 200,000 system gates and 2,000 logic cells for implementing complex digital circuits.
- Memory: Up to 8 Kbits of embedded block RAM (BRAM) for data storage.
- I/O Pins: 256 I/O pins with support for various I/O standards like LVTTL, LVCMOS, and SSTL.
- Speed Grade: Speed grade of -4, offering high performance for various applications.
- Configuration: Supports multiple configuration modes, including JTAG and serial configuration.
- Power Efficiency: Optimized for low power consumption, making it suitable for battery-operated devices.
- Integrated DSP: Up to 4 dedicated DSP slices for efficient signal processing tasks.
- Development Support: Compatible with Xilinx ISE design suite for easy programming and debugging.
These features make the XC3S200-4FTG256C suitable for applications such as digital signal processing, communications, and embedded systems.

Package

The XC3S200-4FTG256C is packaged in a Fine Pitch Ball Grid Array (FBGA) format with 256 balls. This package type ensures a compact design suitable for high-density applications, offering improved thermal performance and electrical connectivity.

Pinout

The XC3S200-4FTG256C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3 series. It features a total of 256 pins. The device is designed for various applications, providing capabilities such as logic functions, signal processing, and system control.
The pin functions include I/O pins, power supply pins, ground pins, configuration pins, and dedicated pins for various functions like JTAG for programming and debugging. The FPGA supports a wide array of standard I/O standards, enabling it to interface with other devices effectively. It also includes programmable logic blocks, DSP slices, and memory resources, making it suitable for a range of digital design applications.

Manufacturer

The XC3S200-4FTG256C is manufactured by Xilinx, Inc., a company that specializes in programmable logic devices. Founded in 1984, Xilinx is a leader in the field of Field Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and system-on-chip (SoC) technologies. The XC3S200 is part of the Spartan-3 family of FPGAs, designed for cost-sensitive applications, offering a balance of performance, power efficiency, and flexibility. Xilinx provides solutions for various industries, including telecommunications, automotive, aerospace, and consumer electronics. In 2020, Xilinx was acquired by AMD, further enhancing its capabilities in adaptive computing and advanced technology development.

Application

The XC3S200-4FTG256C is a Spartan-3 FPGA commonly used in various applications, including digital signal processing, telecommunications, video and image processing, automotive systems, and industrial automation. Its versatility allows for prototyping, custom logic design, and real-time data processing in embedded systems. Additionally, it's used in consumer electronics, medical devices, and aerospace applications due to its low power consumption and high performance.

Equivalent

The XC3S200-4FTG256C is a Spartan-3 FPGA from Xilinx. Equivalent products include:
1. Lattice ECP3-70 - A similar mid-range FPGA.
2. Altera EP3C25 - From the Cyclone III series, offering comparable features.
3. Microsemi IGLOO2 - A low-power FPGA alternative.
These options may vary in specific features and performance, so it's essential to consider your application requirements.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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