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XC3S2000-4FG456I
IC FPGA 333 I/O 456FBGA
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Spezifikationen
| Series | Spartan®-3 |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 46080 |
| Total RAM Bits | 737280 |
| Number of I/O | 333 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 456-BBGA |
| Supplier Device Package | 456-FBGA (23x23) |
| Base Product Number | XC3S2000 |
| Number of LABs/CLBs | 5120 |
| Number of Gates | 2000000 |
Übersicht
Description
Key specifications include:
- Architecture: Spartan-3 architecture optimizes for low power and high performance.
- Configurable Logic Blocks (CLBs): Contains a mix of flip-flops and look-up tables for diverse logic functions.
- Memory: Supports distributed memory, block RAM, and also includes dedicated multiplier capabilities.
- I/O Pins: Offers versatile I/O standards to interface with various peripheral devices.
- Package: The "FG456" indicates a Fine Pitch Ball Grid Array (BGA) package with 456 pins.
Applications range from consumer electronics to automotive and industrial control systems, benefiting from the FPGA's reconfigurability, allowing users to update designs post-deployment. The XC3S2000-4FG456I is ideal for prototyping and low-volume production, facilitating rapid development cycles.
Features
- Logic Cells: Approximately 2,000 logic cells for implementing digital circuits.
- Configurable I/O: 104 user-configurable I/O pins that support various standards.
- Memory: Includes 256 Kbits of block RAM for data storage.
- Multipliers: Integrated DSP slices for efficient digital signal processing.
- High-Speed Performance: Operates at clock frequencies up to 200 MHz.
- Low Power: Designed for low power consumption, suitable for battery-operated devices.
- Packaging: Comes in a 456-pin Fine Pitch Ball Grid Array (FBGA) package.
- JTAG: Supports JTAG for configuration and debugging.
- Built-In Features: Includes phase-locked loops (PLLs) for clock management and various system-level functions.
This FPGA is ideal for applications in communications, automotive, and industrial control systems, leveraging its flexibility and performance.
Package
Pinout
1. Logic Cells: It includes a large number of configurable logic blocks (CLBs) for implementing digital circuits.
2. I/O Pins: Supports multiple I/O standards, including LVTTL, LVCMOS, and SSTL, with a capacity for high-speed interfacing.
3. Dedicated Multi-Gigabit Transceivers: For high-speed data communication applications.
4. Block RAM: Embedded memory blocks for storage and buffering.
5. Digital Signal Processing (DSP) Slices: For efficient signal processing tasks.
6. Configuration and Programming: Supports JTAG, SPI, and other programming methods.
The XC3S2000-4FG456I is designed for a wide range of applications, including communications, automotive, and industrial control systems, offering flexibility and high performance for various digital designs.
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Zahlungen
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