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XC3S2000-4FGG900C
IC FPGA 565 I/O 900FBGA
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Spezifikationen
| Series | Spartan®-3 |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 737280 |
| Number of I/O | 565 |
| Number of Gates | 2000000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 900-BBGA |
| Supplier Device Package | 900-FBGA (31x31) |
| Base Product Number | XC3S2000 |
| Number of Logic Elements/Cells | 46080 |
| Number of LABs/CLBs | 5120 |
Übersicht
Description
This FPGA operates at a maximum clock frequency of 200 MHz and is built on a 90 nm process technology, which enhances performance and power efficiency. The "4" in its designation indicates the speed grade, while "FGG" refers to the package type (Fine Pitch BGA) with 900 pins, facilitating high-density interconnections.
The XC3S2000 offers a range of I/O capabilities, including support for various voltage levels, making it versatile for interfacing with different devices. It is programmable using Xilinx's design tools, such as ISE or Vivado, allowing customization for specific applications. Overall, the XC3S2000-4FGG900C is ideal for developers seeking a flexible, high-performance solution for digital design projects.
Features
- Logic Cells: Up to 2,000 logic cells, allowing for complex digital designs.
- Configurable I/O: Supports up to 232 I/O pins with various I/O standards, enabling flexibility in interfacing with other components.
- DSP Slices: Includes dedicated DSP (Digital Signal Processing) slices for efficient data processing.
- Block RAM: Provides up to 1 MB of block RAM for high-speed memory applications.
- Clock Management: Features advanced clock management capabilities, including phase-locked loops (PLLs) and clock dividers.
- High-Speed Performance: Operates at clock speeds up to 250 MHz, suitable for high-performance applications.
- Low Power Consumption: Designed for low power usage, making it suitable for battery-powered devices.
- Development Tools: Supported by Xilinx's ISE design suite for development and programming.
This FPGA is often used in applications like communications, automotive, and consumer electronics.
Package
Pinout
The main functions of the XC3S2000-4FGG900C include:
1. Logic Implementation: It supports a large number of configurable logic blocks (CLBs) for various digital logic designs.
2. I/O Interfaces: It includes numerous I/O pins that can be configured for different signaling standards (e.g., LVTTL, LVCMOS).
3. Memory Support: It has integrated block RAM for data storage.
4. DSP Support: It can be used for digital signal processing tasks with built-in DSP slices.
5. Configuration and Programming: The device can be programmed via JTAG or other programming methods.
Overall, it is designed for a wide range of applications, including consumer electronics, telecommunications, and automotive systems.
Manufacturer
Application
Versand
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Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
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