XC3S200AN-4FTG256I

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XC3S200AN-4FTG256I

IC FPGA 195 I/O 256FTBGA

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  • Fr. Teil #XC3S200AN-4FTG256I
  • Paket FBGA-256
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Spezifikationen

Package Tray
Series Spartan®-3AN
ProductStatus Active
NumberofLABs/CLBs 448
NumberofLogicElements/Cells 4032
TotalRAMBits 294912
NumberofI/O 195
NumberofGates 200000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 256-LBGA

Übersicht

Description

The XC3S200AN-4FTG256I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3A family. It features 200,000 system gates and is designed for cost-sensitive applications requiring moderate performance. The device operates at a maximum speed of 100 MHz, making it suitable for various digital logic tasks, including signal processing and control applications.
Key specifications include 256 flip-flops, 140 I/O pins, and support for various I/O standards. The FPGA is housed in a 256-ball Fine Pitch Ball Grid Array (FBGA) package, allowing for efficient thermal management and space-saving designs.
The XC3S200AN also supports advanced features such as integrated memory blocks and digital signal processing (DSP) capabilities. It is programmable using Xilinx's ISE Design Suite, enabling developers to create customized hardware solutions.
This device is ideal for applications in telecommunications, automotive, consumer electronics, and industrial control systems, where flexibility and reprogramming capability are critical.

Features

The XC3S200AN-4FTG256I is a member of the Xilinx Spartan-3A FPGA family, designed for low-cost, low-power applications. Key features include:
1. Logic Cells: Approximately 200,000 logic cells, enabling complex designs.
2. I/O Pins: 256 I/O pins with support for various I/O standards, including LVTTL and LVCMOS.
3. Memory: Up to 512 Kb of Block RAM for data storage and buffering.
4. DSP Slices: Contains DSP slices for high-performance arithmetic operations, ideal for signal processing applications.
5. Clock Management: Integrated clock management features, including phase-locked loops (PLLs) for efficient clock generation.
6. Configuration: Supports multiple configuration options such as JTAG and SPI.
7. Power Efficiency: Optimized for low power consumption, making it suitable for battery-operated devices and portable applications.
8. Development Support: Compatible with Xilinx ISE design tools for ease of development.
This FPGA is ideal for applications in consumer electronics, automotive, and industrial control systems.

Package

The XC3S200AN-4FTG256I is packaged in a Fine-Pitch Ball Grid Array (FBGA) format with 256 balls. It is designed for high-density applications and features a 0.8 mm pitch for compact layout.

Pinout

The XC3S200AN-4FTG256I is a Spartan-3A FPGA from Xilinx with a pin count of 256. It features a range of functionalities standard to FPGAs, including:
- Logic Cells: Provides programmable logic resources for implementing digital circuits.
- Memory Blocks: Includes dedicated RAM for data storage.
- I/O Pins: Configurable I/O pins that support various voltage levels and standards for interfacing with external components.
- Digital Signal Processing (DSP) Blocks: Provides specialized hardware for efficient signal processing tasks.
- Clock Management: Features clock management resources, including phase-locked loops (PLLs) for clock distribution and timing control.
This FPGA is suitable for various applications in telecommunications, automotive, industrial, and consumer electronics, providing flexibility and scalability for custom digital designs.

Manufacturer

The manufacturer of the XC3S200AN-4FTG256I is Xilinx, Inc. Xilinx is a leading company in the field of programmable logic devices, specifically focusing on Field-Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and 3D ICs. Founded in 1984, Xilinx is known for pioneering the FPGA technology and has played a significant role in the evolution of programmable solutions in the semiconductor industry. The company serves various sectors, including telecommunications, automotive, industrial, and aerospace, providing solutions that enhance system performance and flexibility. In October 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding its offerings in high-performance computing and adaptive computing solutions.

Application

The XC3S200AN-4FTG256I is a Spartan-3A FPGA used in various application areas, including digital signal processing, communications, automotive systems, industrial control, consumer electronics, and embedded systems. Its low power consumption and high performance make it suitable for applications like video processing, motor control, and prototyping of custom hardware designs.

Equivalent

The XC3S200AN-4FTG256I is a Spartan-3A FPGA. Equivalent products include the XC3S200-4FTG256, XC3S400-4FTG256, and XC3S1000-4FTG256, which offer similar features but vary in logic cell count and performance. Other alternatives might include newer FPGA families like the Xilinx Artix-7 series, depending on specific application requirements, but ensure compatibility with your design.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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