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XC3S250E-4FT256C
IC FPGA 172 I/O 256FTBGA
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Spezifikationen
| Series | Spartan®-3E |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 221184 |
| Number of I/O | 172 |
| Number of Gates | 250000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
| Base Product Number | XC3S250 |
| Number of Logic Elements/Cells | 5508 |
| Number of LABs/CLBs | 612 |
Übersicht
Description
Key specifications include a 4-input LUT (Look-Up Table) architecture, a maximum clock frequency of up to 200 MHz, and up to 228 user I/O pins. The device supports multiple I/O voltage standards, making it versatile for interfacing with different components.
The XC3S250E is housed in a 256-ball Fine Pitch Ball Grid Array (FBGA) package, facilitating efficient thermal management and PCB space optimization. Its capabilities include programmable logic, digital signal processing, and embedded memory, allowing designers to implement complex algorithms and functions.
Xilinx provides a comprehensive development environment, including the ISE Design Suite, which offers design entry, simulation, and synthesis tools to streamline the development process. Overall, the XC3S250E-4FT256C is an accessible yet powerful choice for a wide range of embedded system applications.
Features
- Logic Cells: 250,000 system gates, providing ample logic resources for moderate complexity designs.
- I/O Pins: Up to 92 I/O pins, supporting various I/O standards including LVTTL, LVCMOS, and PCI.
- Memory: Integrated Block RAM (BRAM) with up to 8 Kb of memory per block, allowing for efficient data storage.
- DSP Slices: Supports digital signal processing applications with dedicated DSP slices.
- Configuration: Supports multiple configuration options, including JTAG and slave serial modes.
- Speed Grade: -4 speed grade, enabling a maximum performance of up to 400 MHz.
- Power Consumption: Low power operation, crucial for battery-operated or energy-sensitive applications.
- Development Tools: Compatible with Xilinx ISE design suite for easy development and implementation.
These features make the XC3S250E-4FT256C ideal for a variety of applications, including consumer electronics, automotive systems, and industrial automation.
Package
Pinout
Key specifications include:
- Pin Count: 256
- Logic Cells: 250,000
- Block RAM: 4 Kbits
- I/O Pins: Configurable to accommodate different voltage levels and signaling standards.
- Package Type: Fine-pitch BGA (Ball Grid Array)
The device supports multiple I/O standards, enabling connectivity to different peripherals and integration into diverse applications, such as communications, automotive, and consumer electronics. The XC3S250E is suitable for low-power and cost-sensitive designs while providing flexibility in hardware configuration.
Manufacturer
Application
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Versand
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Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
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Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
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3. Überweisung
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