XC3S400-4FG456C

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XC3S400-4FG456C

IC FPGA 264 I/O 456FBGA

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  • Fr. Teil #XC3S400-4FG456C
  • Paket FBGA-456
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Spezifikationen

Package Bulk
Series Spartan®-3
ProductStatus Active
NumberofLABs/CLBs 896
NumberofLogicElements/Cells 8064
TotalRAMBits 294912
NumberofI/O 264
NumberofGates 400000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 456-BBGA

Übersicht

Description

The XC3S400-4FG456C is a member of the Xilinx Spartan-3 FPGA family. Designed for low-cost, high-performance applications, it features 400,000 system gates and includes 4,752 logic cells, making it suitable for a wide range of digital designs, from simple to complex.
Key specifications include operational voltage ranges from 1.2V to 3.3V, with a maximum clock frequency of up to 200 MHz. It offers a variety of I/O options, supporting various signaling standards, and includes built-in DSP slices for efficient processing of digital signals.
The FPGA is housed in a 456-ball Fine Pitch Ball Grid Array (FBGA) package, facilitating a compact design. It is ideal for applications in communications, automotive, industrial, and consumer electronics, providing flexibility for prototyping and production.
The XC3S400-4FG456C can be programmed using Xilinx’s ISE Design Suite, which supports VHDL and Verilog, enabling designers to implement custom logic and integrate peripherals effectively. Overall, it stands out for its balance of performance, power efficiency, and affordability in the FPGA market.

Features

The XC3S400-4FG456C is a Spartan-3 FPGA (Field Programmable Gate Array) from Xilinx, designed for a range of applications including embedded systems, automotive, and consumer electronics. Key features include:
1. Logic Cells: Approximately 400,000 system gates, providing a balance of performance and density.
2. I/O Pins: 456 pins supporting various I/O standards, including LVTTL, LVCMOS, and PCI.
3. Embedded Block RAM: Up to 18 Kbits of block RAM for efficient memory management.
4. DSP Slices: Integrated DSP slices for high-performance signal processing.
5. Flexibility: Configurable with various design tools, enabling custom hardware implementations.
6. Low Power: Optimized for low power consumption, suitable for portable applications.
7. On-chip Oscillator: Integrated clock management for enhanced timing control.
These features make the XC3S400-4FG456C suitable for high-performance, cost-sensitive applications requiring flexibility and efficiency.

Package

The XC3S400-4FG456C is packaged in a Fine-Pitch Ball Grid Array (FBGA) format. It features 456 balls for connections, allowing for high-density I/O and efficient thermal management in FPGA applications.

Pinout

The XC3S400-4FG456C is a Spartan-3 FPGA from Xilinx, featuring a pin count of 456. It belongs to the Spartan-3 family, which is designed for cost-effective, low-power applications. The device offers various functions including programmable logic, digital signal processing, and I/O interfacing.
Key functionalities include:
- Configurable I/O pins for interfacing with various devices.
- Internal logic blocks that can be programmed for specific tasks, including arithmetic operations and state machines.
- Support for multiple communication protocols through its I/O configuration.
The FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial automation, providing a flexible platform for implementing custom digital logic designs.

Manufacturer

The XC3S400-4FG456C is manufactured by Xilinx, Inc., a prominent company in the semiconductor industry. Xilinx specializes in programmable logic devices, particularly Field-Programmable Gate Arrays (FPGAs), which allow users to configure hardware for specific applications after manufacturing. Founded in 1984 and headquartered in San Jose, California, Xilinx has been a pioneer in digital design and has played a significant role in the development of FPGAs and related technologies. As of my last knowledge update in October 2023, Xilinx is a subsidiary of AMD (Advanced Micro Devices), which acquired the company in a deal completed in early 2022. Xilinx's products are widely used in various sectors, including telecommunications, automotive, aerospace, defense, and industrial applications, making it a key player in the electronics and technology landscape.

Application

The XC3S400-4FG456C is a Spartan-3 FPGA used in various applications, including digital signal processing, communications, industrial automation, automotive systems, and consumer electronics. Its flexibility makes it suitable for prototyping, embedded systems, image processing, and real-time data acquisition. Additionally, it is often employed in academic research and development projects requiring reconfigurable hardware solutions.

Equivalent

The XC3S400-4FG456C is a Spartan-3 FPGA from Xilinx. Equivalent products include the Lattice iCE40 series, Intel (Altera) Cyclone IV series, and Microsemi (now part of Microchip) SmartFusion or IGLOO FPGAs. When selecting alternatives, consider factors like logic density, I/O capabilities, power consumption, and application requirements to ensure compatibility.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

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