XC3S4000-4FGG676I

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XC3S4000-4FGG676I

IC FPGA 489 I/O 676FBGA

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  • Fr. Teil #XC3S4000-4FGG676I
  • Paket FBGA676
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Spezifikationen

Package Tray
Series Spartan®-3
ProductStatus Active
NumberofLABs/CLBs 6912
NumberofLogicElements/Cells 62208
TotalRAMBits 1769472
NumberofI/O 489
NumberofGates 4000000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 676-BGA

Übersicht

Description

The XC3S4000-4FGG676I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3 series, designed for low-cost and high-performance applications. It features 4,000 logic cells, making it suitable for a variety of digital designs, including embedded systems, signal processing, and communications.
Key specifications include:
- Architecture: Based on Xilinx's Spartan-3 architecture, which offers a combination of logic cells, memory, and digital signal processing capabilities.
- Package: It comes in a 676-pin Fine Pitch Ball Grid Array (FBGA) package, allowing for high connection density.
- Power Consumption: Designed for low power usage, making it ideal for portable and battery-operated devices.
- I/O Capabilities: Provides a flexible set of I/O standards to interface with different external components.
Overall, the XC3S4000-4FGG676I is a versatile FPGA suited for various applications where customization and performance are critical.

Features

The XC3S4000-4FGG676I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family. Key features include:
- Logic Cells: Approximately 400,000 System Gates with 5760 logic cells.
- Configurable I/O: 376 I/O pins with support for various I/O standards (LVTTL, LVCMOS, etc.).
- Memory: Up to 240 Kbits of distributed RAM, along with 1.5 Mbits of block RAM.
- Speed Grade: Operates at a maximum clock frequency of up to 200 MHz, depending on design complexity.
- Embedded Features: Supports DSP slices for efficient digital signal processing applications.
- Low Power Consumption: Designed for low power applications, ideal for portable devices.
- Package Type: Comes in a 676-ball Flip-Chip BGA package, facilitating high-density designs.
- Development Tools: Compatible with Xilinx ISE design tools for programming and simulation.
This FPGA is suitable for various applications, including communications, automotive, and consumer electronics, offering flexibility and scalability.

Package

The XC3S4000-4FGG676I is packaged in a Fine Pitch Ball Grid Array (FBGA) format with 676 balls. This type of packaging offers a compact design and efficient thermal performance, suitable for high-density applications.

Pinout

The XC3S4000-4FGG676I is a FPGA (Field Programmable Gate Array) from Xilinx's Spartan-3 series. It features a pin count of 676. The device is designed for a variety of applications, including digital signal processing, embedded systems, and high-performance computing.
Key functions of the XC3S4000-4FGG676I include:
1. Configurable Logic Blocks (CLBs): Contains a large number of programmable logic resources for implementing custom digital circuits.
2. I/O Pins: Supports multiple I/O standards and configurations for interfacing with other devices.
3. Memory Blocks: Includes Block RAM for data storage and buffering.
4. DSP Slices: For performing high-speed arithmetic operations.
5. Clock Management: Features dedicated clock management resources for timing control.
Overall, it provides flexibility for developers to create customized hardware solutions tailored to specific application needs.

Manufacturer

The manufacturer of the XC3S4000-4FGG676I is Xilinx, Inc. Xilinx is a leading company in the semiconductor industry, specializing in the development of field-programmable gate arrays (FPGAs), programmable SoCs (System-on-Chip), and adaptive computing solutions. Founded in 1984, Xilinx was one of the pioneers in FPGA technology, enabling engineers to design and implement custom hardware configurations for a wide range of applications, including telecommunications, automotive, industrial automation, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in the market for adaptive computing and high-performance processing solutions.

Application

The XC3S4000-4FGG676I is a Spartan-3 FPGA used in various applications, including telecommunications, automotive systems, industrial automation, digital signal processing, and embedded systems. It supports high-performance tasks such as video processing, image processing, and data acquisition, making it suitable for prototyping and implementing complex digital circuits. Its flexibility allows for custom hardware solutions in diverse fields like medical devices, consumer electronics, and aerospace.

Equivalent

The XC3S4000-4FGG676I is a Spartan-3 FPGA from Xilinx. Equivalent products include other Spartan-3 FPGAs like the XC3S5000 and XC3S2000, which offer different logic densities and features. Additionally, newer families like Spartan-6 (e.g., XC6SLX45) and Artix-7 (e.g., XC7A200T) provide enhanced performance and capabilities, although they may have different pin configurations and architectures. Always verify compatibility based on specific application requirements.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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