XC3S4000-5FGG676C

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XC3S4000-5FGG676C

IC FPGA 489 I/O 676FBGA

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Spezifikationen

Series Spartan®-3
Part Status Obsolete
DigiKey Programmable Not Verified
Number of Logic Elements/Cells 62208
Total RAM Bits 1769472
Number of I/O 489
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number XC3S4000
Number of LABs/CLBs 6912
Number of Gates 4000000

Übersicht

Description

The XC3S4000-5FGG676C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3 series. It features a capacity of approximately 4,000 logic cells and is designed for a range of applications, including digital signal processing, embedded systems, and custom logic implementations.
Key specifications include:
- Speed Grade: 5, indicating moderate performance.
- Package: FGG676, a fine-pitch ball grid array (FBGA) package with 676 balls for better thermal management and signal integrity.
- I/O Pins: Supports a significant number of user-configurable I/O pins, facilitating integration with various peripherals.
- Power Consumption: Optimized for low power, making it suitable for portable and battery-operated applications.
The XC3S4000 also supports various design tools and languages, including VHDL and Verilog, allowing designers to implement custom logic configurations easily. Its versatility and low cost make it a popular choice for both prototyping and production in the embedded design space.

Features

The XC3S4000-5FGG676C is a member of the Xilinx Spartan-3 family of FPGAs (Field Programmable Gate Arrays). Key features include:
- Logic Cells: 4,000 configurable logic cells, enabling complex logic implementations.
- I/O Pins: Up to 676 I/O pins, supporting various I/O standards.
- Embedded Block RAM: 144 Kbits of embedded block RAM for efficient data storage.
- Digital Signal Processing (DSP): Capable of supporting basic DSP operations with dedicated resources.
- Speed Grade: -5 speed grade, offering a maximum performance of 150 MHz at 25°C.
- Configuration Options: Multi-boot capability and support for various configuration modes (JTAG, SPI, etc.).
- Power Consumption: Low power usage, suitable for battery-operated and portable applications.
- Development Tools: Compatible with Xilinx ISE design suite for ease of design and implementation.
Overall, the XC3S4000-5FGG676C is designed for applications requiring moderate logic capacity with a balance of performance and power efficiency.

Package

The XC3S4000-5FGG676C is packaged in a Fine-Pitch Ball Grid Array (FBGGA) format with 676 balls. This package type provides a compact design and efficient thermal performance suitable for complex FPGA applications.

Pinout

The XC3S4000-5FGG676C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family. It has a total pin count of 676 pins in a Fine Pitch Ball Grid Array (FBGA) package.
The functions of these pins include:
1. I/O Pins: Used for general-purpose input/output, allowing external connections.
2. Power Pins: Provide power supply to the FPGA core and I/O banks.
3. Configuration Pins: Used for configuring the FPGA from external memory or sources.
4. Clock Pins: Dedicated pins for clock signals that drive the internal logic.
5. Ground Pins: Essential for completing electrical circuits and ensuring proper operation.
This FPGA supports a variety of design applications, including digital signal processing, communication, and embedded system designs. The XC3S4000-5 model specifically features a programmable logic capacity of around 4,000 logic cells.

Manufacturer

The XC3S4000-5FGG676C is manufactured by Xilinx, Inc. Xilinx is a leading semiconductor company known for its development of field-programmable gate arrays (FPGAs), programmable system-on-chips (SoCs), and other configurable devices. Founded in 1984, the company pioneered the FPGA technology and has since expanded its portfolio to include a wide range of products for various applications, including telecommunications, automotive, aerospace, and industrial automation. Xilinx is recognized for its innovation and contributions to the programmable logic market, and it was acquired by AMD in 2022, further enhancing its capabilities in high-performance computing and adaptive systems.

Application

The XC3S4000-5FGG676C is a Spartan-3 FPGA from Xilinx, primarily used in applications such as digital signal processing, embedded systems, telecommunications, and automotive electronics. Its versatility makes it suitable for image processing, high-speed data acquisition, and custom logic implementations. Additionally, it is often utilized in consumer electronics, industrial automation, and prototyping due to its balance of performance and cost-effectiveness.

Equivalent

The XC3S4000-5FGG676C is an FPGA from Xilinx's Spartan-3 family. Equivalent products include other Spartan-3 variants like XC3S4000-4FGG676C and XC3S4000-6FGG676C, which differ in speed grade. Additionally, similar alternatives from other families include Altera’s Cyclone series, such as EP3C40, and Lattice's MachXO series, like MachXO2. Always check specific features and compatibility when considering alternatives.

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

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