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XC3S400A-5FGG320C
IC FPGA 251 I/O 320FBGA
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Spezifikationen
| Series | Spartan®-3A |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 368640 |
| Number of I/O | 251 |
| Number of Gates | 400000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 320-BGA |
| Supplier Device Package | 320-FBGA (19x19) |
| Base Product Number | XC3S400 |
| Number of Logic Elements/Cells | 8064 |
| Number of LABs/CLBs | 896 |
Übersicht
Description
Key features include 576 configurable logic blocks (CLBs), 4,608 flip-flops, and extensive routing resources. The XC3S400A also supports embedded block RAM (BRAM) for efficient data storage, and it offers digital signal processing (DSP) slices for performing complex mathematical computations.
Its architecture is highly suitable for applications in communications, automotive, and consumer electronics, providing low power consumption and high performance. The XC3S400A can be configured using the Xilinx ISE design suite, enabling designers to implement custom hardware solutions efficiently. Overall, it is a versatile choice for engineers looking to balance performance, cost, and power in their designs.
Features
1. Logic Cells: Offers approximately 400,000 system gates with 2,016 logic slices, each containing four 6-input LUTs and flip-flops.
2. I/O Pins: Up to 208 I/O pins configurable for various signal standards, supporting both single-ended and differential signaling.
3. Embedded Memory: Supports up to 12 Kbits of block RAM (with various configurations).
4. DSP Slices: Contains dedicated DSP slices for high-performance arithmetic operations.
5. Configuration: Supports multiple configuration methods, including JTAG and serial configuration.
6. Power: Operates at a nominal voltage of 1.2V for core and 3.3V for I/O, optimized for power efficiency.
7. Performance: Capable of achieving high-performance designs with a maximum clock speed up to 200 MHz.
8. Packages: Available in a 320-ball fine-pitch BGA package, enhancing the device’s compactness and thermal management.
This FPGA is ideal for applications in communications, automotive, and industrial control systems.
Package
Pinout
The pin functions include general-purpose I/O (GPIO) pins, dedicated configuration pins, power supply pins, ground pins, and optional clock inputs. It supports various I/O standards, allowing for flexibility in interfacing with other components. The FPGA architecture enables users to implement custom logic designs, and the device provides internal resources such as configurable logic blocks (CLBs), digital signal processing (DSP) slices, and block RAM (BRAM) for efficient data handling and processing.
Overall, the XC3S400A-5FGG320C is suitable for applications requiring moderate logic capacity and performance in a compact form factor.
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Versandgebührenreferenz (DHL/FedEx):
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von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
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Zahlungen
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