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XC3S500E-4FTG256C
IC FPGA 190 I/O 256FTBGA
- Hersteller
- Fr. Teil #XC3S500E-4FTG256C
- Paket BGA-256
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Spezifikationen
| Package | Tray |
| Series | Spartan®-3E |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1164 |
| NumberofLogicElements/Cells | 10476 |
| TotalRAMBits | 368640 |
| NumberofI/O | 190 |
| NumberofGates | 500000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-LBGA |
Übersicht
Description
Key specifications include a 256-ball Thin Fine Pitch Ball Grid Array (TFBGA) package, operating voltage of 3.3V, and a maximum clock frequency of up to 200 MHz. The device supports multiple I/O standards and provides flexible interfacing options, enabling integration with various peripherals.
It is particularly favored in applications such as automotive, industrial control, and consumer electronics due to its balance of performance, power efficiency, and cost-effectiveness. The XC3S500E also benefits from Xilinx's comprehensive development tools, including the ISE Design Suite, which aids in design, simulation, and programming. Overall, it's an ideal choice for engineers looking to implement custom digital circuits in a versatile and scalable manner.
Features
1. Logic Cells: It has 500,000 system gates and offers a significant number of configurable logic blocks (CLBs) for versatile design capabilities.
2. I/O Pins: 256 available I/O pins, supporting various I/O standards for flexible interfacing.
3. Memory: Integrated block RAM (BRAM) with a total of 18 Kbits per block, allowing efficient data storage and processing.
4. DSP Blocks: Includes dedicated DSP slices for high-performance digital signal processing applications.
5. Configuration: Support for multiple configuration modes, including JTAG and serial configurations.
6. Power Efficiency: Designed for low power consumption, making it suitable for battery-operated applications.
7. Operating Voltage: Typically operates at 1.2V core voltage with I/O voltage options ranging from 1.2V to 3.3V.
The XC3S500E is ideal for a wide range of applications, including embedded systems, communications, and consumer electronics.
Package
Pinout
Key functional specifics include:
- Configurable Logic Blocks (CLBs): Used for implementing combinational and sequential logic.
- I/O Blocks: Supports multiple I/O standards, allowing for interfacing with other digital components.
- Dedicated DSP Slices: For high-performance digital signal processing tasks.
- Memory: Contains block RAM for data storage.
- Clock Management: Features clock management tiles for efficient clock distribution.
This FPGA is particularly suited for applications in consumer electronics, automotive, and industrial control systems where integration and performance are crucial.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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