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XC3S500E-4FTG256I
IC FPGA 190 I/O 256FTBGA
- Hersteller
- Fr. Teil #XC3S500E-4FTG256I
- Paket BGA-256
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Spezifikationen
| Package | Tray |
| Series | Spartan®-3E |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1164 |
| NumberofLogicElements/Cells | 10476 |
| TotalRAMBits | 368640 |
| NumberofI/O | 190 |
| NumberofGates | 500000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 256-LBGA |
Übersicht
Description
This FPGA includes 256 I/O pins, enabling extensive connectivity options, and supports various I/O standards like LVTTL and LVCMOS. It operates on a voltage range of 1.2V to 3.3V, making it energy-efficient. The XC3S500E is ideal for applications in telecommunications, automotive, consumer electronics, and industrial control due to its flexibility and reprogrammability.
The device is packaged in a fine-pitch ball grid array (FBGA) format, allowing for compact designs. Additionally, it is supported by Xilinx's development tools, such as ISE and Vivado, which facilitate the design, simulation, and implementation processes. Overall, the XC3S500E-4FTG256I delivers a combination of performance, scalability, and cost-effectiveness for a wide range of digital applications.
Features
1. Logic Cells: It contains up to 500,000 system gates and 2,304 logic cells, providing ample processing power for various applications.
2. Embedded Memory: Supports up to 18 Kbit of block RAM, enabling efficient data storage and manipulation.
3. I/O Performance: Offers up to 70 user-programmable I/O pins, with support for various I/O standards (e.g., LVTTL, LVCMOS).
4. DSP Slices: Includes DSP slices for efficient digital signal processing capabilities.
5. Configurable Logic Blocks (CLBs): Features a flexible architecture for implementing combinatorial and sequential logic functions.
6. Low Power Consumption: Designed for low power operation, making it suitable for battery-operated devices.
7. Development Support: Compatible with Xilinx development tools like ISE, facilitating design and programming.
These features make the XC3S500E-4FTG256I suitable for applications in consumer electronics, automotive, and industrial automation.
Package
Pinout
The device operates at a maximum speed grade of -4 and is packaged in a Fine Pitch Ball Grid Array (FBGA) format (FTG256). The functionality of the XC3S500E includes a variety of digital logic capabilities, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, and memory resources. It supports various I/O standards, making it suitable for numerous applications in areas such as communications, automotive, and industrial control.
Additionally, it provides features like embedded multipliers, block RAM, and a rich set of I/O pins for interfacing with other components, allowing for extensive customization and flexibility in design.
Manufacturer
Application
Equivalent
Versand
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Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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