XC3S500E-4FTG256I

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XC3S500E-4FTG256I

IC FPGA 190 I/O 256FTBGA

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  • Fr. Teil #XC3S500E-4FTG256I
  • Paket BGA-256
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Spezifikationen

Package Tray
Series Spartan®-3E
ProductStatus Active
NumberofLABs/CLBs 1164
NumberofLogicElements/Cells 10476
TotalRAMBits 368640
NumberofI/O 190
NumberofGates 500000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 256-LBGA

Übersicht

Description

The XC3S500E-4FTG256I is a field-programmable gate array (FPGA) from Xilinx's Spartan-3E family, designed for versatile applications in digital logic design. It features 500,000 system gates, 1,840 logic cells, and up to 58,000 flip-flops, allowing for complex digital logic implementations. The "4" in the designation indicates a maximum performance grade of 4, suitable for high-speed applications.
This FPGA includes 256 I/O pins, enabling extensive connectivity options, and supports various I/O standards like LVTTL and LVCMOS. It operates on a voltage range of 1.2V to 3.3V, making it energy-efficient. The XC3S500E is ideal for applications in telecommunications, automotive, consumer electronics, and industrial control due to its flexibility and reprogrammability.
The device is packaged in a fine-pitch ball grid array (FBGA) format, allowing for compact designs. Additionally, it is supported by Xilinx's development tools, such as ISE and Vivado, which facilitate the design, simulation, and implementation processes. Overall, the XC3S500E-4FTG256I delivers a combination of performance, scalability, and cost-effectiveness for a wide range of digital applications.

Features

The XC3S500E-4FTG256I is a member of the Xilinx Spartan-3E FPGA family, designed for cost-sensitive applications. Key features include:
1. Logic Cells: It contains up to 500,000 system gates and 2,304 logic cells, providing ample processing power for various applications.
2. Embedded Memory: Supports up to 18 Kbit of block RAM, enabling efficient data storage and manipulation.
3. I/O Performance: Offers up to 70 user-programmable I/O pins, with support for various I/O standards (e.g., LVTTL, LVCMOS).
4. DSP Slices: Includes DSP slices for efficient digital signal processing capabilities.
5. Configurable Logic Blocks (CLBs): Features a flexible architecture for implementing combinatorial and sequential logic functions.
6. Low Power Consumption: Designed for low power operation, making it suitable for battery-operated devices.
7. Development Support: Compatible with Xilinx development tools like ISE, facilitating design and programming.
These features make the XC3S500E-4FTG256I suitable for applications in consumer electronics, automotive, and industrial automation.

Package

The XC3S500E-4FTG256I is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically with a 256-ball configuration. This package type provides a compact design suitable for high-performance applications, facilitating efficient thermal and electrical performance.

Pinout

The XC3S500E-4FTG256I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3E family. It features a pin count of 256.
The device operates at a maximum speed grade of -4 and is packaged in a Fine Pitch Ball Grid Array (FBGA) format (FTG256). The functionality of the XC3S500E includes a variety of digital logic capabilities, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, and memory resources. It supports various I/O standards, making it suitable for numerous applications in areas such as communications, automotive, and industrial control.
Additionally, it provides features like embedded multipliers, block RAM, and a rich set of I/O pins for interfacing with other components, allowing for extensive customization and flexibility in design.

Manufacturer

The XC3S500E-4FTG256I is manufactured by Xilinx, Inc., which is a prominent company in the semiconductor industry. Xilinx specializes in producing programmable logic devices, including Field-Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and associated software tools. Founded in 1984, Xilinx is known for pioneering the FPGA technology, enabling designers to implement custom hardware solutions for a wide range of applications, including telecommunications, automotive, industrial, and consumer electronics. The company focuses on providing flexible and scalable solutions that meet the evolving needs of the electronics market. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding its influence within the semiconductor ecosystem.

Application

The XC3S500E-4FTG256I is a Spartan-3E FPGA commonly used in applications such as digital signal processing, video and image processing, communication systems, embedded systems, automotive electronics, and industrial automation. Its versatility allows for custom logic design in fields like consumer electronics, robotics, and prototyping for various hardware applications.

Equivalent

The XC3S500E-4FTG256I is a Spartan-3E FPGA from Xilinx. Equivalent products include the Lattice iCE40 series (e.g., iCE40LP1K) and Intel's Cyclone IV series (e.g., EP4CE22). Additionally, Microsemi's IGLOO series (e.g., igloo2) may also serve similar applications, depending on specific requirements like I/O, logic resources, and power consumption. Always verify compatibility based on design needs.

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

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