XC3S700A-4FGG484C

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XC3S700A-4FGG484C

IC FPGA 372 I/O 484FBGA

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  • Fr. Teil #XC3S700A-4FGG484C
  • Paket FBGA484
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Spezifikationen

Package Tray
Series Spartan®-3A
ProductStatus Active
NumberofLABs/CLBs 1472
NumberofLogicElements/Cells 13248
TotalRAMBits 368640
NumberofI/O 372
NumberofGates 700000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 484-BBGA

Übersicht

Description

The XC3S700A-4FGG484C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3A series. It features 700,000 system gates, making it suitable for various applications in digital signal processing, communications, and embedded systems. With a 4-input lookup table (LUT) architecture, it allows for efficient logic implementation and high performance.
The device operates at a maximum clock frequency of up to 200 MHz and includes integrated block RAM, digital signal processing (DSP) slices, and a range of I/O options. It supports a variety of I/O voltage standards, facilitating connectivity with other components. The FPGA is packaged in a 484-pin Fine Pitch Ball Grid Array (FBGA) configuration, promoting a compact design ideal for space-constrained applications.
Designed for low power consumption, the XC3S700A-4FGG484C is ideal for applications like automotive systems, consumer electronics, and industrial automation, providing flexibility for rapid prototyping and design iterations. Its programmable nature allows engineers to update and modify functionality as project requirements evolve.

Features

The XC3S700A-4FGG484C is a Spartan-3A FPGA (Field Programmable Gate Array) from Xilinx, designed for low-cost applications. Key features include:
1. Logic Cells: 700,000 system gates with up to 28,000 logic cells.
2. RAM: Up to 1.8 Mbits of integrated block RAM.
3. DSP Slices: Supports 18x18 bit multipliers for DSP applications.
4. I/O Pins: 484 pins with configurable I/O standards, supporting up to 1,024 I/Os.
5. Configuration: Multiple configuration options including JTAG and serial modes.
6. Performance: Operates at speeds up to 100 MHz with a typical power consumption of 1.5 W.
7. Packages: Available in a Fine Pitch Ball Grid Array (FBGA) package (FGG484).
8. Development Tools: Compatible with Xilinx's ISE Design Suite for design and simulation.
This FPGA is ideal for cost-sensitive applications, including consumer electronics, automotive, and industrial control systems.

Package

The XC3S700A-4FGG484C is packaged in a Fine Pitch Ball Grid Array (FBGA) with 484 balls. This package type offers a compact design suitable for high-density applications, providing enhanced performance and thermal efficiency.

Pinout

The XC3S700A-4FGG484C is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3A series. It features a pin count of 484 pins.
The primary functions of the XC3S700A include logic processing, digital signal processing, and interfacing with various peripherals. It supports multiple I/O standards and configurations, allowing for versatility in applications such as telecommunications, automotive systems, and industrial automation. The device can be configured for different logic functions through programming, making it suitable for prototyping and custom hardware designs.
In summary, the XC3S700A-4FGG484C has 484 pins and is designed for programmable logic applications across various industries.

Manufacturer

The XC3S700A-4FGG484C is manufactured by Xilinx, Inc., which is a technology company known for its programmable logic devices, including Field-Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and System on Chips (SoCs). Founded in 1984, Xilinx specializes in advanced semiconductor technology and is recognized for its contributions to the field of programmable logic, enabling a wide range of applications in industries such as telecommunications, automotive, consumer electronics, and aerospace. The XC3S700A specifically belongs to the Spartan-3A family of FPGAs, designed for low-cost, low-power applications. In 2020, Xilinx was acquired by AMD, further expanding its capabilities in high-performance computing and adaptive computing solutions.

Application

The XC3S700A-4FGG484C is a Spartan-3A FPGA used in various application areas including telecommunications, automotive, consumer electronics, industrial automation, and medical devices. It enables digital signal processing, custom logic implementation, and rapid prototyping. Its versatility supports applications such as image and video processing, embedded systems, and control systems, making it suitable for both commercial and research projects.

Equivalent

The XC3S700A-4FGG484C is a Spartan-3 FPGA by Xilinx. Equivalent products include:
1. XC3S500E - Slightly lower capacity.
2. XC3S1000 - Higher capacity option.
3. Lattice ECP3 series - Similar performance in some applications.
4. Altera Cyclone III - Comparable functionality.
Always check specific requirements and features before selection, as performance may vary.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

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