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XC3S700A-4FGG484C
IC FPGA 372 I/O 484FBGA
- Hersteller
- Fr. Teil #XC3S700A-4FGG484C
- Paket FBGA484
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Spezifikationen
| Package | Tray |
| Series | Spartan®-3A |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1472 |
| NumberofLogicElements/Cells | 13248 |
| TotalRAMBits | 368640 |
| NumberofI/O | 372 |
| NumberofGates | 700000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 484-BBGA |
Übersicht
Description
The device operates at a maximum clock frequency of up to 200 MHz and includes integrated block RAM, digital signal processing (DSP) slices, and a range of I/O options. It supports a variety of I/O voltage standards, facilitating connectivity with other components. The FPGA is packaged in a 484-pin Fine Pitch Ball Grid Array (FBGA) configuration, promoting a compact design ideal for space-constrained applications.
Designed for low power consumption, the XC3S700A-4FGG484C is ideal for applications like automotive systems, consumer electronics, and industrial automation, providing flexibility for rapid prototyping and design iterations. Its programmable nature allows engineers to update and modify functionality as project requirements evolve.
Features
1. Logic Cells: 700,000 system gates with up to 28,000 logic cells.
2. RAM: Up to 1.8 Mbits of integrated block RAM.
3. DSP Slices: Supports 18x18 bit multipliers for DSP applications.
4. I/O Pins: 484 pins with configurable I/O standards, supporting up to 1,024 I/Os.
5. Configuration: Multiple configuration options including JTAG and serial modes.
6. Performance: Operates at speeds up to 100 MHz with a typical power consumption of 1.5 W.
7. Packages: Available in a Fine Pitch Ball Grid Array (FBGA) package (FGG484).
8. Development Tools: Compatible with Xilinx's ISE Design Suite for design and simulation.
This FPGA is ideal for cost-sensitive applications, including consumer electronics, automotive, and industrial control systems.
Package
Pinout
The primary functions of the XC3S700A include logic processing, digital signal processing, and interfacing with various peripherals. It supports multiple I/O standards and configurations, allowing for versatility in applications such as telecommunications, automotive systems, and industrial automation. The device can be configured for different logic functions through programming, making it suitable for prototyping and custom hardware designs.
In summary, the XC3S700A-4FGG484C has 484 pins and is designed for programmable logic applications across various industries.
Manufacturer
Application
Equivalent
1. XC3S500E - Slightly lower capacity.
2. XC3S1000 - Higher capacity option.
3. Lattice ECP3 series - Similar performance in some applications.
4. Altera Cyclone III - Comparable functionality.
Always check specific requirements and features before selection, as performance may vary.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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