XC3SD3400A-4CSG484LI

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XC3SD3400A-4CSG484LI

IC FPGA 309 I/O 484CSBGA

  • Hersteller
  • Fr. Teil #XC3SD3400A-4CSG484LI
  • Paket 484-FBGA, CSPBGA
  • Datenblatt
  • Auf Lager8515

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Spezifikationen

Supplier AMD Xilinx
Package Tray
Series Spartan®-3A DSP
ProductStatus Active
NumberofLABs/CLBs 5968
NumberofLogicElements/Cells 53712
TotalRAMBits 2322432
NumberofI/O 309
NumberofGates 3400000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 484-FBGA, CSPBGA

Übersicht

Description

XC3SD3400A-4CSG484LI is a Xilinx FPGA from the Spartan-3S family. It’s a mid-density, cost-conscious device designed for digital logic, glue logic, and simple DSP tasks in embedded systems.
Key points
- Density: around 3.4k logic cells (configurable logic blocks), with BRAM, DSP slices, and I/O resources.
- Package: 484-ball CSBGA package (CSG484) for compact PCB footprints.
- Speed/temperature: -4 speed grade; LI indicates industrial temperature range and RoHS-compliant packaging.
- Interfaces: multiple I/O banks (3.3V tolerant in many banks), JTAG for programming, and configuration via serial/SPI or other standard Xilinx modes.
- Design flow: use Xilinx ISE/Vivado with Verilog or VHDL; generate a .bit bitstream for configuration.
Common uses: mid-range logic—custom interfaces, control logic, small DSP/signal paths, and glue logic in cost-sensitive designs.
For precise electrical specs (I/O counts, BRAM, DSP resources, exact timing, power) consult the official Xilinx datasheet for XC3SD3400A-4CSG484LI.

Features

Here are the typical features for XC3SD3400A-4CSG484LI (Spartan-3A DSP FPGA in 484-ball BGA, -LI RoHS):
- FPGA fabric: about 3.4K logic cells (Spartan-3A/DSP style)
- DSP resources: dedicated DSP slices with embedded multipliers
- Memory: on-chip distributed RAM plus block RAM options
- I/O: multiple I/O banks with LVTTL/LVCMOS signaling (3.3V I/O discussed for many banks)
- Clock/PLL: flexible clocking options for clock management
- Configuration: support for JTAG and various factory/user configuration methods
- Package: 484-ball BGA (CSG484), lead-free/ROHS-compliant LI variant
- Speed grade: -4 (fast per-device options)
- Temperature: industrial range variants often supported (temperature spec per datasheet)
For exact numbers (logic cells, BRAM counts, DSP slice count, I/O count, min/max I/O voltage, exact temp range), please consult the official datasheet.

Package

CSG484 refers to a 484-ball Chip-Scale Grid (BGA) package.

Pinout

- Pin count: 484 pins (CSG484 package).
- Function: Xilinx FPGA — Spartan-3A DSP family device (programmable logic with DSP capabilities for digital logic/DSP applications).

Manufacturer

Manufacturer: Xilinx, Inc.
Xilinx is a multinational semiconductor company that designs and markets programmable logic devices (FPGA and CPLD) along with related software and IP. It is a leading provider of programmable hardware solutions; it was acquired by AMD in 2022 and operates as a subsidiary.

Application

XC3SD3400A-4CSG484LI is a Spartan-3SD CPLD used for glue logic and peripheral interfacing. Common applications include finite-state machines and control logic for microprocessors/MCUs, clock distribution/deskew, address/data decoding, I/O expansion, protocol bridging (SPI, I2C, UART, parallel buses), timing-critical signaling, and simple digital signal manipulation in automotive, industrial, consumer electronics, networking, and instrumentation.

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