XC3SD3400A-4FGG676C

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XC3SD3400A-4FGG676C

IC FPGA 469 I/O 676FBGA

  • Hersteller
  • Fr. Teil #XC3SD3400A-4FGG676C
  • Paket 676-BGA
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Spezifikationen

Supplier AMD Xilinx
Package Tray
Series Spartan®-3A DSP
ProductStatus Active
NumberofLABs/CLBs 5968
NumberofLogicElements/Cells 53712
TotalRAMBits 2322432
NumberofI/O 469
NumberofGates 3400000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 676-BGA

Übersicht

Description

XC3SD3400A-4FGG676C is Xilinx’s Spartan-3A DSP FPGA in a high-density FG676 BGA packaging. It targets DSP/logic-heavy designs with a mid-to-high logic capacity.
Key points:
- Density: roughly 3.4k logic cells (approximate; exact figures in the datasheet).
- Architecture: configurable logic blocks with 4-input LUTs and flip-flops, dedicated DSP slices (MAC units), RAM resources (block and distributed RAM), PLLs, and I/O banks.
- Package: FG676 (676-ball BGA); speed grade -4; temperature range C (industrial).
- Configuration: supports standard Xilinx config methods (JTAG, SPI/config memory, etc.).
- Applications: DSP and signal-processing, communications, embedded control, data-path processing, interface bridging.
- Documentation: refer to the XC3SD3400A-4FGG676C datasheet and user guide on Xilinx's website for exact specs, timing, and package pinout.
If you need precise logic-cell count, RAM sizes, DSP slice counts, or pinout, I can pull those from the official datasheet.

Features

Key features of XC3SD3400A-4FGG676C (Spartan-3S, FG676 package):
- FPGA: Spartan-3S device in 676-pin FineLine BGA (FG676)
- Logic density: approximately 3,400 logic cells
- RAM: distributed RAM plus block RAM resources
- DSP: dedicated multipliers/DSP slices for arithmetic
- I/O: multiple banks with 3.3V I/O (and 2.5V-tolerant options available)
- Clocking: clock management with PLLs for flexible timing
- Configuration: JTAG and SPI configuration options
- Speed grade: -4 (timing performance)
- Power/temperature: suitable for industrial ranges with typical low-power operation
Note: for exact counts (RAM bits, I/O counts, DSP slice numbers) refer to the official Xilinx datasheet.

Package

Package type: 676-ball Fine-GG BGA (FGG676) package, Commercial temperature range (XC3SD3400A-4FGG676C).

Pinout

- Pin count: 676 pins (FG676C Fine-GP/BGA package)
- Function: FPGA (Xilinx Spartan-3S family) – a programmable logic device for implementing digital circuits.

Manufacturer

- Manufacturer: Xilinx, Inc. (now a subsidiary of AMD).
- What kind of company: An American multinational semiconductor company that designs and manufactures programmable logic devices (FPGAs and CPLDs) and related software.

Application

Application areas:
- Digital logic and DSP implementations (custom logic, filters, encoders/decoders)
- Embedded systems (MicroBlaze soft processor integration)
- Communications hardware and data-path processing (SERDES, interface bridging)
- Video/image processing and display interfaces
- Industrial automation, motor control, and sensor interfacing
- Automotive and consumer electronics prototyping (cost-efficient, rugged programmable logic)

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