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XC4VLX25-10FFG668C
IC FPGA 448 I/O 668FCBGA
- Hersteller
- Fr. Teil #XC4VLX25-10FFG668C
- Paket 668FCBGA
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Spezifikationen
| Package | Tray |
| Series | Virtex®-4 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 2688 |
| NumberofLogicElements/Cells | 24192 |
| TotalRAMBits | 1327104 |
| NumberofI/O | 448 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 668-BBGA, FCBGA |
Übersicht
Description
This FPGA also integrates advanced features such as DSP slices for high-speed signal processing, embedded block RAM, and support for various I/O standards, making it versatile for applications in telecommunications, automotive, industrial automation, and video processing. Its reprogrammability enables designers to update functionality even after deployment, providing flexibility and reducing time-to-market. Overall, the XC4VLX25-10FFG668C is ideal for applications demanding a balance of performance, power efficiency, and design flexibility.
Features
1. Logic Capacity: It contains 25,000 logic cells, allowing for complex designs and parallel processing.
2. Speed Grade: The "-10" indicates a speed grade, providing a maximum performance of 250 MHz.
3. Configurable I/O: Supports various I/O standards, with up to 624 I/O pins, allowing flexibility in interfacing.
4. Memory: Includes embedded block RAM (BRAM) and distributed RAM, enhancing data storage capabilities.
5. DSP Slices: Features dedicated DSP slices for high-performance arithmetic operations, suitable for signal processing applications.
6. Power Consumption: Optimized for low power, making it suitable for portable and energy-efficient designs.
7. Package: Comes in a fine pitch ball grid array (FBGA) package with 668 balls, allowing for a compact design footprint.
Overall, the XC4VLX25-10FFG668C is ideal for a range of applications, including telecommunications, automotive, and embedded systems.
Package
Pinout
In terms of functionality, the device supports a wide range of applications, including digital signal processing, embedded processing, and high-speed data communication. Key features include:
- Configurable logic blocks (CLBs) for implementing custom logic circuits.
- Digital signal processing (DSP) slices for efficient arithmetic operations.
- High-speed I/O capabilities with support for various standards, including LVDS.
- Block RAM for on-chip memory storage.
- Advanced feature sets like partial reconfiguration, which allows dynamic updates to the configuration without interrupting operation.
This FPGA is suitable for applications requiring significant processing power and flexibility.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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