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XC4VLX25-11FFG668C
IC FPGA 448 I/O 668FCBGA
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Spezifikationen
| Series | Virtex®-4 LX |
| Part Status | Active |
| Base Product Number | XC4VLX25 |
| DigiKey Programmable | Not Verified |
| Number of LABs/CLBs | 2688 |
| Number of Logic Elements/Cells | 24192 |
| Total RAM Bits | 1327104 |
| Number of I/O | 448 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | 668-BBGA, FCBGA |
| Supplier Device Package | 668-FCBGA (27x27) |
| Packaging | Tray |
Übersicht
Description
Key specifications include 668 I/O pins, support for various I/O standards, and a high-speed serial interface. The FPGA can be programmed to implement custom hardware designs, allowing for flexibility in design changes without the need for physical hardware modifications. Additionally, it supports various development tools and IP cores, simplifying the design process.
With a robust architecture that includes dedicated DSP slices and high-performance interconnects, the XC4VLX25 is designed for high-speed operations and complex applications, making it a popular choice among engineers and developers in the field of digital design.
Features
1. Logic Cells: Approximately 25,000 logic cells, allowing complex designs and applications.
2. Memory: 1.5 Mb of block RAM for data storage and efficient memory management.
3. DSP Slices: Integrated DSP slices for high-speed arithmetic operations, suitable for digital signal processing tasks.
4. I/O Pins: Up to 66 user-configurable I/O pins, supporting various signaling standards such as LVTTL, LVCMOS, and PCI.
5. Packages: Available in a 668-ball FFG package, facilitating compact design layouts.
6. Performance: Operates at speeds up to 550 MHz, enabling rapid data processing.
7. Power Efficiency: Features advanced power management capabilities, enhancing overall energy efficiency.
8. Development Ecosystem: Supported by Xilinx ISE design tools, providing a comprehensive environment for design and verification.
This FPGA is suitable for applications in telecommunications, automotive, and industrial control systems.
Package
Pinout
This FPGA is designed for high-performance applications and features a range of functionalities including digital signal processing, high-speed serial connectivity, and high-density logic. It supports multiple I/O standards, offers various logic resources, and includes embedded block RAM and digital signal processing slices.
The device operates at a maximum clock frequency of 400 MHz and is suitable for applications in telecommunications, automotive, and industrial control. The FF in the part number indicates that it has a Flip-Chip package, while the G in FFG indicates a ball grid array (BGA) format.
Overall, the XC4VLX25-11FFG668C is versatile and suitable for complex digital system designs.
Manufacturer
Application
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Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
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Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
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