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XC6SLX100-2FGG676I
IC FPGA 480 I/O 676FBGA
- Hersteller
- Fr. Teil #XC6SLX100-2FGG676I
- Paket FBGA-676
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Spezifikationen
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 7911 |
| NumberofLogicElements/Cells | 101261 |
| TotalRAMBits | 4939776 |
| NumberofI/O | 480 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 676-BGA |
Übersicht
Description
This specific model comes in a Fine Pitch Ball Grid Array (FBGA) package with 676 pins, providing flexible I/O options. It operates with a maximum clock frequency of up to 550 MHz and supports various I/O standards. The XC6SLX100 also includes built-in DSP slices for efficient signal processing and has multiple dedicated configuration modes to facilitate easy integration into designs.
Moreover, the device's low power consumption makes it suitable for battery-operated applications. Development tools like Xilinx ISE and Vivado support design implementation, allowing engineers to leverage its capabilities effectively. Overall, the XC6SLX100-2FGG676I is an ideal choice for diverse applications requiring programmable logic solutions.
Features
1. Logic Cells: 100,000 system logic cells for complex designs.
2. Configurable I/O: Supports up to 150 I/O pins with various voltage standards.
3. Memory: Includes up to 6.6 Mb of embedded memory (block RAM).
4. DSP Slices: 60 DSP slices for high-performance arithmetic operations.
5. Power Efficiency: Low power consumption with multiple operating modes.
6. Performance: Maximum clock frequency of up to 550 MHz.
7. Package: Available in a 676-ball Fine Pitch Ball Grid Array (FBGA) package.
8. Development Tools: Compatible with Xilinx ISE design suite for programming and simulation.
Overall, the XC6SLX100-2FGG676I is suitable for applications requiring high performance and flexibility in a compact form factor.
Package
Pinout
Key pin functions include:
- I/O Pins: Configurable for general-purpose input/output, supporting various standards such as LVTTL, LVCMOS, and more.
- Power Supply Pins: Include VCC and GND connections for powering the device.
- Configuration Pins: Used for programming and configuring the FPGA.
- Clock Pins: Dedicated pins for clock input, supporting different clocking architectures.
- Dedicated High-Speed Serial Pins: For applications requiring high-speed data transfer.
The XC6SLX100-2FGG676I is well-suited for applications in communications, automotive, and industrial control due to its balance of logic resources and I/O capabilities.
Manufacturer
Application
Equivalent
1. Lattice ECP5 (e.g., LFE5U-45F-6MG285C)
2. Intel/Altera Cyclone IV (e.g., EP4CE100F23C8N)
3. Microsemi SmartFusion2 (e.g., M2S050-1FGG484)
4. Actel/Microsemi ProASIC3 (e.g., A3P1000)
These alternatives provide similar capabilities and performance for various applications.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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