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XC6SLX16-2CSG225C
IC FPGA 160 I/O 225CSBGA
- Hersteller
- Fr. Teil #XC6SLX16-2CSG225C
- Paket CSBGA-225
- Datenblatt
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Spezifikationen
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1139 |
| NumberofLogicElements/Cells | 14579 |
| TotalRAMBits | 589824 |
| NumberofI/O | 160 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 225-LFBGA, CSPBGA |
Übersicht
Description
With a 225-ball Fine Pitch Ball Grid Array (FBGA) package, it offers a compact footprint suitable for space-constrained environments. The XC6SLX16 includes embedded memory blocks, digital signal processing (DSP) slices, and various I/O capabilities, supporting multiple voltage levels for interfacing with diverse components.
This FPGA is ideal for applications in consumer electronics, automotive systems, industrial automation, and telecommunications, providing flexibility for prototyping and deployment. Additionally, it is compatible with the Xilinx ISE Design Suite, allowing users to leverage a robust development environment for efficient design and implementation.
Features
1. Logic Cells: 16,000 logic cells, enabling a range of complex digital designs.
2. I/O Pins: Up to 108 user-configurable I/O pins for flexible interfacing.
3. Memory: Supports up to 4.5 Mbits of block RAM for data storage.
4. DSP Slices: Includes 24 DSP slices for efficient signal processing tasks.
5. Power: Low power consumption, suitable for battery-operated devices.
6. Configuration: Multiple configuration options, including JTAG and SPI.
7. Integrated Features: Supports high-speed transceivers and dedicated clock management.
8. Development Tools: Compatible with Xilinx ISE design suite for streamlined design and debugging.
This FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial automation, combining performance and resource efficiency.
Package
Pinout
The device operates at a maximum clock frequency suitable for a range of applications, with functionalities including high-speed serial communication, memory interfacing, and general-purpose logic operations. The package type for the XC6SLX16-2CSG225C is a Fine Pitch Ball Grid Array (FBGA), which allows for efficient thermal and electrical performance.
Key features include support for multiple I/O standards, built-in configuration options, and the ability to implement complex algorithms and data processing tasks. This makes the XC6SLX16-2CSG225C suitable for various applications in communications, automotive, industrial control, and consumer electronics.
Manufacturer
Application
Equivalent
1. Lattice ECP5-5G-85
2. Altera Cyclone IV EP4CE15
3. Microsemi SmartFusion2 M2S010
4. Lattice MachXO2-256
These alternatives vary in features, performance, and capacity, so it's essential to assess specific requirements before selecting an equivalent.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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