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XC6SLX16-3FTG256C
IC FPGA 186 I/O 256FTBGA
- Hersteller
- Fr. Teil #XC6SLX16-3FTG256C
- Paket FBGA-256
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Spezifikationen
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1139 |
| NumberofLogicElements/Cells | 14579 |
| TotalRAMBits | 589824 |
| NumberofI/O | 186 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-LBGA |
Übersicht
Description
Key specifications include a maximum clock frequency of 400 MHz, 7.5 Gbps transceiver capability, and various memory resources including block RAM and distributed RAM. The 3FTG256C version indicates that it operates at a standard speed grade and comes in a thin quad flat package (TQFP) with 256 pins.
Designed with a rich set of configuration options, the XC6SLX16 allows for ease of implementation and flexibility in design. The integrated development tools from Xilinx, such as Vivado and ISE, facilitate efficient design entry, simulation, and synthesis. Overall, the XC6SLX16-3FTG256C is well-suited for applications requiring a balance of performance, power, and cost-effectiveness.
Features
1. Logic Cells: 16,000 logic cells, allowing for complex designs.
2. I/O Pins: Up to 100 user-programmable I/O pins, supporting various interfaces and protocols.
3. Memory: Supports up to 576 Kbits of block RAM and distributed RAM, enabling efficient data storage and processing.
4. DSP Slices: Integrated DSP (Digital Signal Processing) slices for high-performance arithmetic operations.
5. Configuration: Offers multiple configuration options, including JTAG, SPI, and SelectMAP.
6. Power Efficiency: Low power consumption, suitable for battery-operated and portable applications.
7. Package: Comes in a 256-ball FPBGA package, facilitating compact design layouts.
These features make the XC6SLX16-3FTG256C suitable for various applications such as automotive, communications, industrial control, and consumer electronics.
Package
Pinout
1. Configurable Logic Blocks (CLBs): Used for implementing combinational and sequential logic.
2. Digital Signal Processing (DSP) slices: For high-performance arithmetic operations.
3. Block RAM: On-chip memory for data storage.
4. I/O Pins: Configurable to support various standards (e.g., LVTTL, LVCMOS).
5. Dedicated clock management: Includes clock dividers and phase-locked loops (PLLs).
6. JTAG Support: For configuration and debugging purposes.
The XC6SLX16-3FTG256C is suitable for a range of applications in communications, automotive, and consumer electronics due to its low power consumption and versatility.
Manufacturer
Application
Equivalent
1. Lattice Semiconductor: LatticeECP3-70
2. Altera (Intel): Cyclone III EP3C16
3. Microsemi: SmartFusion2 M2S010
4. Xilinx: XC6SLX16-2FTG256 (different speed grade)
These alternatives may vary in performance, features, and power consumption. Always check specific application requirements when considering alternatives.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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