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XC6SLX25-2CSG324C
IC FPGA 226 I/O 324CSBGA
- Hersteller
- Fr. Teil #XC6SLX25-2CSG324C
- Paket CSBGA-324
- Datenblatt
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Spezifikationen
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1879 |
| NumberofLogicElements/Cells | 24051 |
| TotalRAMBits | 958464 |
| NumberofI/O | 226 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 324-LFBGA, CSPBGA |
Übersicht
Description
Key specifications include:
- Architecture: Based on the Xilinx 6 series, emphasizing a combination of high performance and low power consumption.
- Logic Cells: 25,000, enabling complex design implementations.
- Memory: Up to 1,536 Kbits of block RAM, facilitating data storage needs for applications.
- Dedicated DSP Slices: For efficient digital signal processing tasks.
- Package: Available in a 324-pin CSG (Chip Scale Grid) package, suitable for compact designs.
Ideal for applications in automotive, consumer electronics, and industrial automation, the XC6SLX25-2CSG324C provides flexibility and scalability for engineers looking to integrate FPGA technology into their projects.
Features
1. Logic Cells: 25,000 logic cells, allowing for complex designs.
2. DSP Slices: Integrated DSP slices for efficient digital signal processing.
3. Memory: Up to 1.5 Mb of block RAM for data storage.
4. I/O Pins: 24 configurable I/O pins with support for various I/O standards.
5. Operating Voltage: Low voltage operation at 1.2V, enhancing power efficiency.
6. Configuration: Supports multiple configuration options, including JTAG and SPI.
7. Embedded Features: Integrated clock management with phase-locked loops (PLLs) and clock dividers.
8. Package: Comes in a 324-ball Fine-Pitch Ball Grid Array (FBGA) package, suitable for space-constrained applications.
Overall, the XC6SLX25-2CSG324C is ideal for applications requiring moderate logic capacity, power efficiency, and flexibility in design.
Package
Pinout
- Logic Resources: It has 25,000 logic cells, which can be utilized for various digital logic functions.
- I/O Pins: There are multiple I/O pins available for interfacing with external components and circuits, supporting various I/O standards.
- DSP Slices: It includes DSP slices for efficient digital signal processing tasks.
- Block RAM: The device is equipped with block RAM for memory storage.
- Clock Management: Features such as digital clock managers (DCMs) for effective clock signal management.
This combination of resources allows it to be used in a wide range of applications, including telecommunications, automotive, and consumer electronics.
Manufacturer
Application
Equivalent
1. XC6SLX25-3CSG324C - Same features with a different speed grade.
2. XC6SLX30-2CSG324C - Higher logic cell count.
3. XC6SLX25-2CSG484C - Same speed grade in a larger package.
These options maintain compatibility in terms of functions and pin configurations. Always verify specific requirements and constraints for your application.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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