XC6SLX25-3FTG256C

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XC6SLX25-3FTG256C

IC FPGA 186 I/O 256FTBGA

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  • Fr. Teil #XC6SLX25-3FTG256C
  • Paket FBGA-256
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Spezifikationen

Package Tray
Series Spartan®-6 LX
ProductStatus Active
NumberofLABs/CLBs 1879
NumberofLogicElements/Cells 24051
TotalRAMBits 958464
NumberofI/O 186
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 256-LBGA

Übersicht

Description

The XC6SLX25-3FTG256C is a member of the Xilinx Spartan-6 FPGA family, designed for low-power, cost-sensitive applications. It features a 256-ball Fine Pitch BGA (FPBGA) package and is built on a 45 nm process technology, which enhances performance and reduces power consumption.
With a logic capacity of 25,000 logic cells, this FPGA supports various applications, including automotive, consumer electronics, and industrial systems. Key features include up to 1,536 Kbits of block RAM, 12 DSP slices for high-performance digital signal processing, and flexible I/O configurations that allow for high-speed communication protocols.
The device operates at a maximum clock frequency of 400 MHz, making it suitable for demanding processing tasks. Additionally, it supports various development tools from Xilinx, including the ISE Design Suite, facilitating design entry, synthesis, and implementation. The XC6SLX25-3FTG256C is ideal for applications requiring efficient processing power without compromising on cost or power efficiency.

Features

The XC6SLX25-3FTG256C is a Spartan-6 Field Programmable Gate Array (FPGA) from Xilinx. Key features include:
1. Logic Cells: 25,000 logic cells, supporting high-density designs.
2. Configurable I/O: 256 I/O pins with support for a variety of I/O standards.
3. Memory: Integrated block RAM (BRAM) with up to 1.5 Mb of memory.
4. DSP Slices: Up to 20 DSP slices for high-performance arithmetic operations.
5. Low Power Consumption: Designed for low power applications, ideal for battery-operated devices.
6. Flexible Architecture: Configurable interconnect architecture for optimized performance.
7. Development Support: Compatibility with Xilinx development tools like Vivado and ISE.
8. Embedded Features: Option for embedded power management and clock management capabilities.
9. Package Type: Available in a 256-ball Fine Pitch Ball Grid Array (FBGA) package.
This FPGA is suitable for various applications, including automotive, industrial, and consumer electronics.

Package

The XC6SLX25-3FTG256C is packaged in a Fine-Pitch Ball Grid Array (FBGA) format with 256 balls.

Pinout

The XC6SLX25-3FTG256C is a member of the Xilinx Spartan-6 FPGA family. It features a pin count of 256.
The device is designed for low-power applications and includes various I/O configurations, digital signal processing capabilities, and support for different voltage levels. It offers functionality such as programmable logic, integrated RAM, DSP slices, and various communication interfaces. The Spartan-6 FPGAs are known for their balance of performance, power efficiency, and cost-effectiveness, making them suitable for a wide range of applications, including consumer electronics, automotive, and industrial control systems.
For specific pin functions and configurations, consulting the device's detailed datasheet or user guide is recommended.

Manufacturer

The XC6SLX25-3FTG256C is manufactured by Xilinx, Inc., a company that specializes in field-programmable gate arrays (FPGAs), programmable SoCs, and other related technologies. Xilinx is known for its innovative approach to programmable logic devices and has been a leading player in the semiconductor industry. The company focuses on providing solutions that enable designers to create custom hardware for a wide range of applications, including telecommunications, automotive, aerospace, and industrial automation. Xilinx was acquired by AMD (Advanced Micro Devices) in 2020, further expanding its capabilities in high-performance computing and adaptive computing solutions.

Application

The XC6SLX25-3FTG256C is a low-power FPGA from Xilinx, suitable for various applications, including embedded systems, digital signal processing, communications, industrial automation, and automotive systems. Its flexibility allows for custom logic implementations, prototyping, and hardware acceleration in edge computing. It is commonly used in applications requiring energy-efficient processing, such as IoT devices, video processing, and machine learning inferencing.

Equivalent

The XC6SLX25-3FTG256C is a Xilinx Spartan-6 FPGA. Equivalent products include the Lattice ECP5 series (e.g., LFE5U-25F), Altera Cyclone IV (e.g., EP4CE25), and Microsemi IGLOO2 (e.g., M2GL025). These alternatives offer similar logic density and functionality for various applications. Compatibility will depend on specific project requirements, so verify features and performance criteria when considering alternatives.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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