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XC6SLX25-3FTG256I
IC FPGA 186 I/O 256FTBGA
- Hersteller
- Fr. Teil #XC6SLX25-3FTG256I
- Paket FBGA-256
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- Auf Lager3793
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Spezifikationen
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1879 |
| NumberofLogicElements/Cells | 24051 |
| TotalRAMBits | 958464 |
| NumberofI/O | 186 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 256-LBGA |
Übersicht
Description
Key specifications include:
- Technology: 45nm CMOS process.
- Package: 256-ball FBG (Fine Pitch Ball Grid Array) package.
- I/O: Supports up to 56 I/O pins, with various I/O standards.
- Power Consumption: Optimized for low power usage, making it ideal for battery-operated devices.
- Performance: Offers a maximum clock frequency of around 550 MHz, enabling high-speed operation.
The device is programmable via VHDL or Verilog and integrates features like built-in memory blocks, DSP slices, and clock management. It is commonly used in applications like automotive, industrial control, and consumer electronics, providing flexibility and scalability for developers.
Features
- Logic Cells: 25,000 available logic cells for complex designs.
- Configurable I/O: Supports up to 150 user-configurable I/O pins, enabling versatile interfacing options.
- Performance: Operates at a maximum clock frequency of 400 MHz, suitable for high-speed applications.
- Memory: Includes up to 1,344 Kbits of embedded block RAM for data storage and processing.
- DSP Slices: Features 24 DSP slices for signal processing tasks.
- Power Efficiency: Optimized for low power, ideal for battery-operated devices.
- Package: Available in a 256-ball FBGAA (Fine Pitch Ball Grid Array) package, facilitating compact designs.
- Development Tools: Compatible with Xilinx design tools such as Vivado and ISE for easy implementation and simulation.
These features make the XC6SLX25-3FTG256I suitable for a wide range of applications, including automotive, industrial, and consumer electronics.
Package
Pinout
Key functions of the XC6SLX25-3FTG256I include:
1. Configurable Logic Blocks (CLBs): Contains configurable logic elements to implement digital logic functions.
2. I/O Capabilities: Supports a wide range of I/O standards for interfacing with other devices.
3. DSP Slices: Provides dedicated digital signal processing capabilities.
4. Memory Blocks: Includes embedded block RAM for data storage and buffering.
5. Clock Management: Features clock management resources such as clock dividers and phase-locked loops (PLLs).
The device is designed for low-power applications while delivering a flexible and efficient solution for various digital design needs.
Manufacturer
Application
Equivalent
1. XC6SLX25-3FTG256C - Slightly different temperature grade.
2. XC6SLX25-3FGG484I - Different package and pin count.
3. Lattice ECP5 - A similar low-power FPGA alternative.
4. Altera Cyclone IV - Comparable performance FPGA from Intel/Altera.
Always verify compatibility based on specific application requirements.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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