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XC6SLX75-2FGG484I
IC FPGA 280 I/O 484FBGA
- Hersteller
- Fr. Teil #XC6SLX75-2FGG484I
- Paket BGA-484
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Spezifikationen
| Package | Tray |
| Series | Spartan®-6 LX |
| ProductStatus | Active |
| NumberofLABs/CLBs | 5831 |
| NumberofLogicElements/Cells | 74637 |
| TotalRAMBits | 3170304 |
| NumberofI/O | 280 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 484-BBGA |
Übersicht
Description
The “2” in the part number indicates a specific speed grade, while “FGG484” denotes the package type and size, which is a fine-pitch ball grid array (FBGA) with 484 balls. The device is optimized for low power consumption, making it suitable for battery-operated devices and portable applications. Additionally, it includes built-in digital signal processing (DSP) capabilities, making it effective for signal processing tasks.
The XC6SLX75-2FGG484I's combination of performance, power efficiency, and programmability makes it a popular choice in industries such as telecommunications, automotive, and consumer electronics.
Features
- Logic Cells: Up to 75,000 logic cells for complex designs.
- Configurable I/O: 484-pin package with versatile I/O capabilities, supporting various voltage standards.
- Memory: Embedded block RAM (BRAM) up to 4.5 Mbits for high-performance memory storage.
- DSP Slices: Up to 48 DSP slices for efficient signal processing.
- Power Efficiency: Optimized for low power consumption, ideal for battery-operated devices.
- High-Speed Transceivers: Supports up to 1 Gbps serial connectivity options.
- Development Tools: Compatible with Xilinx ISE design suite for easy implementation and debugging.
- Temperature Range: Available in industrial-grade versions for extended temperature ranges.
This FPGA is suitable for a wide range of applications, including communications, automotive, industrial automation, and consumer electronics.
Package
Pinout
The device includes multiple I/O banks, each capable of supporting various voltage levels and offering different I/O standards. It also features integrated resources such as logic cells, DSP slices, and block RAM for efficient processing and data handling. The specific functions of the pins include general-purpose I/O, configuration, power supply, and ground connections, among others.
This FPGA is optimized for low power consumption while providing high performance, making it suitable for applications requiring flexibility and efficiency.
Manufacturer
Application
Equivalent
1. LatticeECP3: Specifically, models like LFE3-70EA or LFE3-70E.
2. Altera Cyclone III: Cyclone III EP3C75F484C6N.
3. Microsemi SmartFusion: SmartFusion2 devices with comparable logic resources.
Check specific datasheets for detailed feature comparisons and compatibility.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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