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XC6SLX75-3FGG676C
IC FPGA 408 I/O 676FBGA
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Spezifikationen
| Series | Spartan®-6 LX |
| Part Status | Active |
| Base Product Number | XC6SLX75 |
| DigiKey Programmable | Not Verified |
| Number of LABs/CLBs | 5831 |
| Number of Logic Elements/Cells | 74637 |
| Total RAM Bits | 3170304 |
| Number of I/O | 408 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
| Packaging | Tray |
Übersicht
Description
With 676 pins in a Fine-Pitch Ball Grid Array (FBGA) package, it provides ample I/O flexibility. The device supports various interfaces, including PCI Express, SPI, and I2C, making it versatile for different applications such as communication, automotive, and consumer electronics.
The XC6SLX75 integrates advanced features like DSP slices for digital signal processing tasks, block RAM, and support for multiple voltage levels. It is programmable using VHDL or Verilog, allowing for customization according to the specific needs of a project. The Spartan-6 series emphasizes low power consumption while maintaining reliable performance, making it suitable for both prototyping and production environments.
Features
- Logic Cells: 75,000 logic cells, enabling complex digital logic designs.
- DSP Slices: Up to 48 DSP slices for high-performance digital signal processing.
- Memory: 4.9 Mb of Block RAM for efficient data storage and retrieval.
- I/O Pins: 676 I/O pins, supporting various interfaces and protocols.
- Speed Grade: -3 speed grade, offering a balance of performance and power consumption.
- Power Consumption: Low power operation, making it suitable for battery-powered applications.
- Configurable Logic Blocks (CLBs): Contains configurable blocks for user-defined logic.
- Integrated Clock Management: Built-in Clock Management Tiles (CMTs) for efficient clock distribution.
- Protocols Support: Supports various communication protocols, including PCIe and Ethernet.
- Development Tools: Compatible with Xilinx ISE design suite for development and debugging.
This FPGA is ideal for applications in automotive, industrial control, telecommunications, and more, due to its flexibility and performance.
Package
Pinout
The 3 in the part number indicates the speed grade, which influences the operating frequency and power consumption. The FGG package type signifies a Fine Pitch Ball Grid Array (FBGA) with a thermal rating suitable for high-performance applications. Overall, the XC6SLX75-3FGG676C is well-suited for a variety of digital design tasks requiring flexibility and processing capabilities.
Manufacturer
Application
Equivalent
Versand
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Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
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3. Überweisung
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