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XC7A200T-L2FBG676E
IC FPGA 400 I/O 676FCBGA
- Hersteller
- Fr. Teil #XC7A200T-L2FBG676E
- Paket FCBGA-676
- Datenblatt
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Spezifikationen
| Package | Tray |
| Series | Artix-7 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 16825 |
| NumberofLogicElements/Cells | 215360 |
| TotalRAMBits | 13455360 |
| NumberofI/O | 400 |
| Voltage-Supply | 0.95V ~ 1.05V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 676-BBGA, FCBGA |
Übersicht
Description
Housed in a 676-ball Fine Pitch BGA (Ball Grid Array) package, it offers flexibility in design and layout. The FPGA is suitable for applications such as digital signal processing, embedded systems, and video processing, making it ideal for industries like telecommunications, automotive, and consumer electronics.
The Artix-7 architecture emphasizes power efficiency and performance, utilizing Xilinx's 28nm technology. Users can program the XC7A200T using tools like Vivado Design Suite, enabling the implementation of custom digital logic and hardware acceleration.
Features
- Logic Cells: 215,360 logic cells with a variety of configurations for efficient design implementation.
- DSP Slices: 740 DSP slices, ideal for high-performance digital signal processing applications.
- Block RAM: 13.1 Mb of integrated block RAM for flexible data storage and retrieval.
- I/O Pins: Supports up to 200 I/O pins, facilitating connections to various peripherals and interfaces.
- Transceivers: Features high-speed transceivers for reliable communication, supporting data rates up to 6.6 Gbps.
- Power: Operates with a low power consumption profile (1.0V core voltage), making it suitable for energy-sensitive applications.
- Packaging: Comes in a fine-pitch BGA package (676-pin) for compact designs.
This FPGA is widely used in applications such as communications, automotive, and industrial control, offering a balance of performance, flexibility, and cost-effectiveness.
Package
Pinout
The FPGA is designed for high-performance applications with a variety of functionalities, including digital signal processing, high-speed communication, and embedded processing. It supports various I/O standards, including LVDS, LVCMOS, and others, catering to a wide range of interfacing needs. The architecture includes resources such as configurable logic blocks, DSP slices, and RAM, enabling flexible design implementations. The device operates at a maximum clock frequency of 450 MHz, providing substantial processing power for complex applications.
This FPGA is commonly used in applications like image processing, video processing, and communication systems, where its high-speed capabilities and adaptability are essential.
Manufacturer
Application
Equivalent
1. Intel (Altera) Cyclone V GX - 5CEFA2F23C7N
2. Lattice Semiconductor ECP5 - LFE5UM-25F-6BG381C
3. Microsemi (now part of Microchip) SmartFusion2 - M2S150TS-1FG484
When choosing an equivalent, consider factors such as logic density, performance, I/O options, and power consumption.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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