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XC7K410T-3FFG900E
IC FPGA 500 I/O 900FCBGA
- Hersteller
- Fr. Teil #XC7K410T-3FFG900E
- Paket BGA900
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Spezifikationen
| Package | Tray |
| Series | Kintex®-7 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 31775 |
| NumberofLogicElements/Cells | 406720 |
| TotalRAMBits | 29306880 |
| NumberofI/O | 500 |
| Voltage-Supply | 0.97V ~ 1.03V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 900-BBGA, FCBGA |
Übersicht
Description
With a 900-ball FFG package and a power-efficient architecture, the XC7K410T is optimized for applications in telecommunications, automotive, industrial automation, and data processing. It incorporates advanced features such as transceivers with data rates up to 6.6 Gbps, enabling high-speed communication.
Additionally, the Kintex-7 series benefits from Xilinx's Vivado Design Suite, which streamlines the design process through improved synthesis and implementation tools. Overall, the XC7K410T-3FFG900E combines performance, versatility, and power efficiency, making it a popular choice for developers needing robust FPGA solutions.
Features
1. Logic Cells: Approximately 410,000 logic cells, offering substantial parallel processing capabilities.
2. DSP Slices: 840 DSP slices for efficient digital signal processing, enabling complex algorithms in real-time.
3. Block RAM: 21 Mbits of block RAM for high-speed memory access.
4. Transceivers: 32 multi-gigabit transceivers supporting up to 6.6 Gbps, facilitating high-speed data communication.
5. I/O Pins: 600 I/O pins with support for various I/O standards, making it versatile for different applications.
6. Power Efficiency: Designed for low power consumption, suitable for portable and battery-operated devices.
7. Configuration: Flexible configuration options, including JTAG and SPI.
This FPGA is ideal for applications in telecommunications, automotive systems, industrial automation, and more, where high performance and flexibility are critical.
Package
Pinout
The FPGA includes resources such as configurable logic blocks (CLBs), digital signal processing (DSP) slices, block RAM, and various I/O standards for flexibility in design. The pins serve multiple functions, including power supply, ground, and I/O for user-defined signals, enabling interfacing with other components in a system. The device is commonly used in applications such as telecommunications, industrial control, and high-speed data processing.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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