XC7Z030-1FFG676I

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XC7Z030-1FFG676I

IC SOC CORTEX-A9 667MHZ 676FCBGA

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Spezifikationen

Series Zynq®-7000
Part Status Active
Base Product Number XC7Z030
Architecture MCU, FPGA
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAM Size 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 667MHz
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Operating Temperature -40°C ~ 100°C (TJ)
Package 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Packaging Tray

Übersicht

Description

The XC7Z030-1FFG676I is a specific model of the Xilinx Zynq-7000 series SoC (System on Chip), integrating both a dual-core ARM Cortex-A9 processor and programmable logic (FPGA) capabilities. It features 30,000 logic cells, 1 MB of block RAM, and various I/O options, making it suitable for a wide range of applications in embedded systems, digital signal processing, and hardware acceleration.
The device operates at a maximum frequency of 1 GHz for the ARM processors and supports multiple interfaces, including USB, Ethernet, and UART. Its flexibility allows developers to design custom hardware accelerators alongside software applications, optimizing performance for specific tasks.
The XC7Z030-1FFG676I comes in a compact 676-ball FFG package, supporting high-density applications. Its combination of processing power and reconfigurable hardware makes it ideal for applications like automotive, industrial automation, and telecommunications. Overall, the Zynq-7000 series represents a powerful platform for modern embedded computing solutions.

Features

The XC7Z030-1FFG676I is a member of the Xilinx Zynq-7000 series, combining a dual-core ARM Cortex-A9 processor with FPGA capabilities. Key features include:
- Processing System: Dual ARM Cortex-A9 cores with a clock speed up to 1 GHz.
- FPGA Fabric: 28nm technology, with 30,800 logic cells, 4,320 Kbits of on-chip RAM, and 220 DSP slices for high-performance processing.
- I/O Options: 76 programmable I/O pins, supporting various interfaces such as I2C, SPI, UART, and GPIO.
- Memory Interfaces: Supports DDR3, DDR2, and LPDDR2 memory, enabling high-bandwidth memory access.
- High-Speed Connectivity: Integrated support for USB 2.0, Gigabit Ethernet, and various serial interfaces.
- Integrated Power Management: Includes power-on reset and various power supply options.
- Development Support: Compatible with Xilinx design tools like Vivado and SDSoC for streamlined design processes.
This combination of processing and programmable logic makes it suitable for applications in embedded systems, automotive, industrial automation, and communication.

Package

The XC7Z030-1FFG676I is packaged in a FFG676 (Fine-Pitch Ball Grid Array) package. This package features 676 balls arranged in a grid format, providing a compact footprint suitable for high-density applications, while allowing for efficient thermal and electrical performance.

Pinout

The XC7Z030-1FFG676I is a Zynq-7000 series SoC (System on Chip) from Xilinx, featuring a total of 676 pins. The device integrates a dual-core ARM Cortex-A9 processor and programmable logic.
The pin functions include:
- Power and Ground Pins: Supply voltage (VCC) and ground (GND) connections.
- Configuration Pins: For JTAG and configuration (e.g., MIO pins).
- I/O Pins: General-purpose I/O (GPIO) lines for interfacing with other peripherals.
- Clock Pins: Dedicated clock inputs for timing.
- Differential Pins: High-speed I/O for transceivers (e.g., MGTs).
- Memory Interfaces: Pins for connecting external memory like DDR.
- Communication Interfaces: Pins for protocols such as SPI, I2C, UART, and CAN.
This combination provides flexibility in design, allowing for various applications ranging from embedded systems to complex processing tasks.

Manufacturer

The XC7Z030-1FFG676I is manufactured by Xilinx, Inc., a company known for its innovative programmable logic devices and system-on-chip (SoC) solutions. Founded in 1984, Xilinx specializes in field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and software development tools. The XC7Z030-1FFG676I is part of the Zynq-7000 series, which integrates a FPGA with an ARM Cortex-A9 processor, providing a versatile platform for various applications, including embedded systems, automotive, and telecommunications. In 2021, Xilinx was acquired by AMD (Advanced Micro Devices), enhancing its capabilities in the semiconductor industry.

Application

The XC7Z030-1FFG676I is a Zynq-7000 SoC that integrates a dual-core ARM Cortex-A9 processor with FPGA fabric. Its application areas include embedded systems, industrial automation, robotics, automotive systems, telecommunications, video processing, and IoT devices. It is widely used in scenarios requiring real-time processing, data handling, and hardware acceleration.

Equivalent

The XC7Z030-1FFG676I is part of the Xilinx Zynq-7000 series. Equivalent products include the XC7Z020-1FFG676I, which has fewer resources, and the XC7Z035-1FFG676I, which offers more resources. Other alternatives could be from different series, such as the Xilinx Artix-7 or Intel/Altera SoC FPGAs, but specifications and capabilities will vary. Always check compatibility for specific applications.

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von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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