XC7Z035-2FBG676I

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XC7Z035-2FBG676I

IC SOC CORTEX-A9 800MHZ 676FCBGA

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  • Fr. Teil #XC7Z035-2FBG676I
  • Paket FCBGA-676
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Spezifikationen

Package Tray
Series Zynq®-7000
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAMSize 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
PrimaryAttributes Kintex™-7 FPGA, 275K Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 676-BBGA, FCBGA

Übersicht

Description

The XC7Z035-2FBG676I is a member of the Xilinx Zynq-7000 series, which combines a dual-core ARM Cortex-A9 processor and Xilinx 7-series FPGA fabric on a single chip. This SoC (System on Chip) architecture facilitates the integration of hardware and software, enabling efficient data processing and control.
Key features include:
- Processing System (PS): Dual ARM Cortex-A9 cores, running up to 1 GHz, with support for various operating systems, including Linux.
- Programmable Logic (PL): 35,000 logic cells, allowing for customized hardware acceleration and high-performance parallel processing.
- I/O Capabilities: Multiple I/O interfaces, including GPIO, UART, SPI, and I2C, facilitating connectivity with various peripherals.
- Memory Interfaces: Supports DDR3/DDR2 memory, enhancing data throughput and storage capability.
The XC7Z035 is ideal for applications in embedded systems, telecommunications, automotive, and industrial control, where both processing power and customizable hardware logic are required.

Features

The XC7Z035-2FBG676I is a member of the Xilinx Zynq-7000 series, combining a dual-core ARM Cortex-A9 processor with programmable logic (FPGA) capabilities. Key features include:
- Dual-Core ARM Cortex-A9: Up to 1 GHz, allowing for efficient processing and multitasking.
- FPGA Fabric: 35,000 logic cells with support for various I/O standards, enabling custom hardware acceleration.
- Memory: 1 MB of on-chip RAM and support for external DDR3/DDR2 memory interfaces.
- I/O: 76 configurable I/O pins with multiple I/O standards, including LVTTL, LVCMOS, and differential signaling.
- High-Speed Connectivity: Integrated Ethernet (10/100/1000 Mbps), USB 2.0, and support for various high-speed transceivers.
- Power Management: Operates at a voltage range of 0.95V to 1.0V for core and 3.3V for I/O, with low power consumption.
- Development Tools: Supported by Xilinx Vivado Design Suite for easy programming and design integration.
This combination makes the XC7Z035-2FBG676I ideal for applications in embedded systems, industrial automation, and automotive sectors.

Package

The XC7Z035-2FBG676I is packaged in a Fine Pitch Ball Grid Array (FBGA) with 676 balls. This type of package provides a compact design and efficient thermal performance, suitable for high-density applications.

Pinout

The XC7Z035-2FBG676I is a Xilinx Zynq-7000 series device that features 676 pins in a Fine-Pitch Ball Grid Array (FBGA) package. This device integrates a dual-core ARM Cortex-A9 processor along with programmable logic, enabling a combination of software and hardware design flexibility.
The pin functions include:
- Power and Ground Pins: Provide power supply and ground connections.
- I/O Pins: Configurable for various interfaces like GPIO, UART, SPI, I2C, and others.
- Dedicated High-Speed Interface Pins: Support for HDMI, USB, and PCIe.
- Configuration Pins: Used for programming the device.
- Clock Pins: For inputting clock signals.
Overall, the XC7Z035-2FBG676I is designed for applications requiring both a strong processing capability and extensive programmable logic resources.

Manufacturer

The XC7Z035-2FBG676I is manufactured by Xilinx, Inc., a leading company in the field of programmable logic devices. Xilinx specializes in designing and producing Field Programmable Gate Arrays (FPGAs), System on Chips (SoCs), and other semiconductor products. Founded in 1984, Xilinx is recognized for pioneering the FPGA technology, which allows users to configure hardware according to their specific requirements. The company serves a wide range of industries, including telecommunications, automotive, aerospace, and consumer electronics, providing solutions that enhance performance, flexibility, and scalability in electronic designs. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in the semiconductor market.

Application

The XC7Z035-2FBG676I, part of the Xilinx Zynq-7000 series, is commonly used in applications such as embedded systems, industrial automation, robotics, medical devices, automotive systems, and telecommunications. It combines a dual-core ARM Cortex-A9 processor with programmable logic, enabling it to handle real-time processing, control tasks, and complex algorithms efficiently, making it suitable for designs requiring high performance and flexibility.

Equivalent

The XC7Z035-2FBG676I is a Zynq-7000 SoC from Xilinx, featuring a dual-core ARM Cortex-A9 and FPGA capabilities. Equivalent products include:
1. XC7Z030-2FBG676I - Slightly fewer resources.
2. XC7Z045-2FBG676I - More resources, including additional logic and memory.
3. Intel Cyclone V SoCs - Comparable performance but from Intel.
Always check specific requirements, as compatibility may vary based on application needs.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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