XC7Z035-L2FBG676I

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XC7Z035-L2FBG676I

IC SOC CORTEX-A9 800MHZ 676FCBGA

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  • Fr. Teil #XC7Z035-L2FBG676I
  • Paket FCBGA-676
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Spezifikationen

Package Tray
Series Zynq®-7000
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAMSize 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
PrimaryAttributes Kintex™-7 FPGA, 275K Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 676-BBGA, FCBGA

Übersicht

Description

The XC7Z035-L2FBG676I is a specific model of the Xilinx Zynq-7000 series, which combines a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA logic. This integration facilitates a flexible architecture for applications requiring both processing power and programmable logic, making it suitable for embedded systems, telecommunications, automotive, industrial automation, and more.
Key features include:
- Processor: Dual-core ARM Cortex-A9, up to 1 GHz, which supports a rich operating system environment.
- FPGA Fabric: 35,000 logic cells, numerous DSP slices, and block RAM for advanced digital design.
- I/O Options: Numerous I/O standards and interfaces, including USB, Ethernet, UART, and more, enabling versatile connectivity.
- Package: LFBGA (Low-Profile Ball Grid Array) with 676 balls, suitable for compact designs.
The XC7Z035's combination of processing and programmable logic allows for high-performance, real-time applications, making it a powerful choice for developers looking to innovate in various fields.

Features

The XC7Z035-L2FBG676I is a member of the Xilinx Zynq-7000 series, which combines a dual-core ARM Cortex-A9 processor with programmable logic (FPGA). Key features include:
1. Processor: Dual-core ARM Cortex-A9, up to 1 GHz.
2. FPGA Fabric: 35,000 logic cells, with support for various I/O standards.
3. Memory: 512 MB of DDR3 memory controller, supporting up to 1066 Mbps.
4. I/O: 76 user I/O pins, configurable for various interfaces like GPIO, SPI, I2C, and more.
5. Transceivers: Up to 4 GTX transceivers for high-speed serial communication.
6. Power: Low power consumption, typical usage around 0.5 W.
7. Connectivity: Ethernet, USB, and various other connectivity options.
8. Applications: Ideal for embedded systems, automotive, industrial, and communication applications.
This combination of processing power and programmable logic makes it suitable for a wide range of applications requiring high performance and flexibility.

Package

The XC7Z035-L2FBG676I is packaged in a Fine-Pitch Ball Grid Array (FBGA) format with 676 balls. This type of package provides a compact design with high pin density, suitable for high-performance applications in Zynq-7000 SoC devices.

Pinout

The XC7Z035-L2FBG676I is a member of the Xilinx Zynq-7000 series SoC (System on Chip) family. It features a total of 676 pins in a Fine Pitch Ball Grid Array (FBGA) package.
The functions of the pins include:
- Processing System (PS) Interfaces: These pins provide connections for ARM Cortex-A9 cores, memory interfaces (DDR3, etc.), and peripherals (USB, UART, SPI, I2C).
- Programmable Logic (PL) Interfaces: The FPGA part of the device includes various I/O pins and dedicated configuration pins for custom logic applications.
- Power and Ground Pins: Essential for the operation and stability of the device.
- Configuration Pins: Used for device configuration at power-up.
This combination of features enables a wide range of applications, from embedded systems to complex data processing tasks.

Manufacturer

The XC7Z035-L2FBG676I is manufactured by Xilinx, Inc., a company that specializes in developing field-programmable gate arrays (FPGAs), system-on-a-chip (SoC) devices, and other programmable logic solutions. Xilinx is known for its innovation in the semiconductor industry, particularly for its contributions to adaptable computing technology.
Founded in 1984, Xilinx was a pioneer in the FPGA market and has since expanded its offerings to include a wide range of products used in various applications, from telecommunications and automotive to industrial automation and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities and market reach. The XC7Z035-L2FBG676I is part of the Zynq-7000 series, which integrates a dual-core ARM Cortex-A9 processor with FPGA fabric, making it suitable for embedded systems requiring both processing and programmable logic.

Application

The XC7Z035-L2FBG676I is a Zynq-7000 series SoC from Xilinx, widely used in applications such as industrial automation, robotics, automotive systems, medical devices, and telecommunications. Its combination of programmable logic and ARM-based processing makes it suitable for real-time data processing, machine learning, video processing, and embedded control systems, offering flexibility and high performance for various applications.

Equivalent

The XC7Z035-L2FBG676I is a Zynq-7000 SoC from Xilinx. Equivalent products include:
1. XC7Z030-1FBG676C - Slightly lower performance.
2. XC7Z045-1FBG676C - Higher performance variant.
3. XC7Z035-1FBG676C - Same performance with different speed grade.
Compatibility may vary based on specific application requirements, so check datasheets for detailed specifications.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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