XC7Z100-2FFG900I

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XC7Z100-2FFG900I

IC SOC CORTEX-A9 800MHZ 900FCBGA

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  • Paket FBGA-900
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Spezifikationen

Package Tray
Series Zynq®-7000
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
RAMSize 256KB
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 800MHz
PrimaryAttributes Kintex™-7 FPGA, 444K Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 900-BBGA, FCBGA

Übersicht

Description

The XC7Z100-2FFG900I is a powerful System on Chip (SoC) from Xilinx's Zynq-7000 series, combining a dual-core ARM Cortex-A9 processor with programmable logic (FPGA). It features 100K logic cells and supports various I/O interfaces, making it suitable for diverse applications like embedded systems, automotive, and industrial automation.
Key specifications include a maximum clock frequency of 1 GHz, 1 MB of on-chip memory, and a range of peripherals such as UART, I2C, and SPI. The device is available in a FFG package with 900 pins, providing robust connectivity options.
Designed for high performance and flexibility, the XC7Z100-2FFG900I enables developers to leverage both software and hardware programmability, facilitating rapid prototyping and deployment of complex applications. It also supports a wide range of development tools and frameworks, enhancing productivity for engineers.

Features

The XC7Z100-2FFG900I is a member of the Xilinx Zynq-7000 series, which combines a dual-core ARM Cortex-A9 processor with Xilinx 7-series FPGA fabric. Key features include:
1. Processing System: Dual ARM Cortex-A9 cores, capable of running at up to 1 GHz, supporting advanced operating systems.
2. FPGA Fabric: 100K logic cells, with 4,800 Kbits of block RAM and 220 DSP slices for high-performance computations.
3. I/O Capabilities: Supports various I/O standards and has up to 84 programmable I/Os.
4. High-Speed Interfaces: Includes support for Gigabit Ethernet, USB 2.0, and HDMI, among others.
5. Power Supply: Operates at a nominal voltage of 1.0V to 1.2V for the core and 2.5V or 3.3V for I/O.
6. Package: Available in a compact FFG900 package, optimizing space in embedded systems.
7. Temperature Range: Industrial-grade with an extended operating temperature from -40°C to +100°C.
This combination of processing and programmable logic makes it suitable for diverse applications such as automotive, communications, and industrial control.

Package

The XC7Z100-2FFG900I is packaged in a 900-pin FFG (Fine Pitch Ball Grid Array) package. It features a compact design suitable for high-density applications, providing excellent thermal performance and signal integrity.

Pinout

The XC7Z100-2FFG900I is a member of the Xilinx Zynq-7000 series, featuring a total of 900 pins in a FFG package. This device has 100,000 logic cells and integrates a dual-core ARM Cortex-A9 processor along with programmable FPGA logic.
The pin functions include:
- Power Supply Pins: VCC and GND pins for power connections.
- I/O Pins: Configurable for various functions, including GPIO, communication interfaces (I2C, SPI, UART), and high-speed transceivers.
- Configuration Pins: For JTAG and other configuration methods.
- Clock Pins: For external clock inputs.
- Dedicated Memory Interfaces: Interfaces for connecting to external RAM (DDR3, etc.).
These features enable a wide range of applications, including embedded systems, signal processing, and custom hardware accelerators.

Manufacturer

The XC7Z100-2FFG900I is manufactured by Xilinx, Inc., a company known for designing and developing programmable logic devices and associated software. Xilinx specializes in field-programmable gate arrays (FPGAs), system-on-chip (SoC) devices, and complex programmable logic devices (CPLDs). Founded in 1984, Xilinx pioneered the FPGA technology, enabling engineers to create customizable hardware for various applications, including telecommunications, automotive, industrial, and consumer electronics. The XC7Z100, part of the Zynq-7000 series, integrates a dual-core ARM Cortex-A9 processor with FPGA fabric, allowing for versatile designs that combine software programmability and hardware flexibility. In 2020, Xilinx was acquired by AMD, further expanding its reach in the semiconductor market.

Application

The XC7Z100-2FFG900I is a Zynq-7000 SoC from Xilinx, commonly used in applications such as embedded processing, industrial automation, automotive systems, medical devices, and communication systems. Its combination of ARM Cortex-A9 processing and programmable logic makes it suitable for real-time processing, image and signal processing, and hardware acceleration tasks in various domains.

Equivalent

The XC7Z100-2FFG900I is a Zynq-7000 series System on Chip (SoC) from Xilinx. Equivalent products include the XC7Z100-1FFG900I, which has a different speed grade, and the XC7Z010 and XC7Z020 models, which offer lower performance capabilities. Other alternatives may include devices from competitors like Intel's Cyclone V SoCs or Microsemi's SmartFusion series, depending on specific application requirements and features.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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