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XCKU115-2FLVA1517I
IC FPGA 624 I/O 1517FCBGA
- Hersteller
- Fr. Teil #XCKU115-2FLVA1517I
- Paket FBGA-1517
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Spezifikationen
| Package | Tray |
| Series | Kintex® UltraScale™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 82920 |
| NumberofLogicElements/Cells | 1451100 |
| TotalRAMBits | 77721600 |
| NumberofI/O | 624 |
| Voltage-Supply | 0.922V ~ 0.979V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 1517-BBGA, FCBGA |
Übersicht
Description
Key specifications include a large number of programmable I/O, support for various memory interfaces, and advanced features like built-in high-speed serial connectivity. The device also supports various design tools, including Vivado, which allows for efficient design entry, simulation, and implementation.
The XCKU115-2FLVA1517I is ideal for applications requiring parallel processing, high throughput, and low latency, such as machine learning, video processing, and real-time data analytics. Its versatility and performance make it a popular choice among engineers and developers looking to accelerate their designs and achieve greater functionality in their systems.
Features
1. Logic Cells: Offers up to 1,050,000 logic cells for complex designs.
2. DSP Slices: Contains up to 840 DSP slices, ideal for high-performance signal processing.
3. Memory: Provides significant on-chip memory, with up to 44.9 Mb of block RAM.
4. Transceivers: Equipped with 32 high-speed transceivers supporting up to 28 Gbps for robust data communication.
5. I/O: Offers a wide variety of I/O options, supporting LVDS, LVCMOS, and more, facilitating diverse connectivity.
6. Power Efficiency: Designed for low power consumption while maintaining high performance.
7. Heat Management: Features an advanced thermal management system for reliable operation under load.
This FPGA is suitable for applications in data centers, wireless communication, and high-performance computing.
Package
Pinout
In terms of functionality, the XCKU115 supports high-performance processing, offering advanced capabilities for digital signal processing, data handling, and high-speed communication tasks. It includes a range of resources such as configurable logic blocks (CLBs), digital signal processing (DSP) slices, block RAM, and high-speed transceivers, making it suitable for applications in sectors like telecommunications, automotive, and industrial automation.
Additionally, it provides various interfaces, including PCIe, Ethernet, and others, facilitating integration into diverse systems. The device is also designed for high reliability and performance in demanding environments.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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