XCKU115-2FLVB1760I

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XCKU115-2FLVB1760I

IC FPGA 702 I/O 1760FCBGA

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  • Fr. Teil #XCKU115-2FLVB1760I
  • Paket FBGA-1760
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Spezifikationen

Package Bulk
Series Kintex® UltraScale™
ProductStatus Active
NumberofLABs/CLBs 82920
NumberofLogicElements/Cells 1451100
TotalRAMBits 77721600
NumberofI/O 702
Voltage-Supply 0.922V ~ 0.979V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 1760-BBGA, FCBGA

Übersicht

Description

The XCKU115-2FLVB1760I is a high-performance FPGA (Field-Programmable Gate Array) from Xilinx's Kintex UltraScale series. It features a 16nm FinFET technology, providing enhanced speed and power efficiency. The device has 1,500,000 logic cells, a large number of DSP slices, and ample memory resources, making it suitable for demanding applications such as data processing, video processing, and high-frequency trading.
The “2” in the designation indicates the speed grade, while “FLVB1760” refers to the package type and pin count. The FPGA supports various I/O standards and connectivity options, allowing integration with diverse systems. It is also compatible with Xilinx's development tools, including Vivado, facilitating design and implementation.
This FPGA is ideal for applications requiring high bandwidth and low latency, such as telecommunications, aerospace, automotive, and industrial automation. Its flexibility allows for reconfiguration post-deployment, making it a preferred choice for evolving technology needs.

Features

The XCKU115-2FLVB1760I is a high-performance FPGA from Xilinx's Kintex UltraScale family. It features:
1. Architecture: Utilizes a 16nm FinFET technology, providing enhanced performance and lower power consumption.
2. Logic Resources: Offers 115K logic cells, 3360 Kbits of block RAM, and up to 576 DSP slices for efficient data processing.
3. I/O Interfaces: Supports various I/O standards, including LVDS, LVCMOS, and others, with up to 720 user I/Os.
4. Performance: Delivers high clock speeds, facilitating complex computations and high-throughput applications.
5. Connectivity: Includes multiple high-speed transceivers (up to 28 Gbps), supporting various protocols like PCIe, Ethernet, and Serial RapidIO.
6. Power Management: Features advanced power management capabilities, enabling dynamic power scaling and optimization.
7. Applications: Ideal for data centers, telecommunications, automotive, and embedded systems requiring high bandwidth and performance.
This combination of features makes the XCKU115-2FLVB1760I suitable for a wide range of demanding applications.

Package

The XCKU115-2FLVB1760I is packaged in a FFG (Fine Fine Pitch Ball Grid Array) format, specifically a 1760-ball configuration. This type of package provides high I/O density and is designed for advanced applications requiring robust performance and efficient thermal management.

Pinout

The XCKU115-2FLVB1760I is a part of the Xilinx Kintex UltraScale FPGA family. It has a pin count of 1,760 pins.
The pin functions of this device include various I/O, power, ground, and configuration pins. The I/O pins can be configured for different standards, allowing for high-speed communication and integration with other components. The FPGA supports multiple protocols such as PCIe, Ethernet, and more, making it suitable for a wide range of applications, including data centers, telecommunications, and industrial systems.
Additionally, the device features dedicated pins for clock management, configuration (JTAG), and power supply connections. It is designed for flexibility and performance, suitable for high-performance computing tasks.

Manufacturer

The manufacturer of the XCKU115-2FLVB1760I is Xilinx, Inc., which is a subsidiary of Advanced Micro Devices (AMD). Xilinx is known for its development of field-programmable gate arrays (FPGAs), system-on-a-chip (SoC) designs, and other programmable logic devices. The company specializes in providing adaptable computing solutions for a wide range of applications, including telecommunications, automotive, aerospace, and industrial automation. Xilinx's products enable engineers to create customized hardware solutions that can be reprogrammed to meet changing requirements, making them versatile for various industries.

Application

The XCKU115-2FLVB1760I is a versatile FPGA from Xilinx's Kintex UltraScale family, suitable for various application areas, including high-performance computing, data center acceleration, telecommunications, video processing, automotive systems, industrial automation, and machine learning. Its capabilities in parallel processing and high-speed I/O make it ideal for applications requiring significant data throughput and real-time processing.

Equivalent

The XCKU115-2FLVB1760I is a part of Xilinx's Kintex UltraScale FPGA family. Equivalent products may include other models in the Kintex UltraScale series, such as XCKU110, XCKU125, or similar devices within the Kintex family, depending on the specific requirements like logic cells, I/O configurations, and performance needs. Additionally, comparable FPGAs from other manufacturers, such as Intel's Stratix 10 or Lattice's ECP5, may serve as alternatives based on application requirements. Always verify features and compatibility before making substitutions.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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