XCKU11P-2FFVD900E

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XCKU11P-2FFVD900E

IC FPGA 408 I/O 900FCBGA

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  • Fr. Teil #XCKU11P-2FFVD900E
  • Paket FBGA-900
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Spezifikationen

Package Tray
Series Kintex® UltraScale+™
ProductStatus Active
NumberofLABs/CLBs 37320
NumberofLogicElements/Cells 653100
TotalRAMBits 53964800
NumberofI/O 408
Voltage-Supply 0.825V ~ 0.876V
MountingType Surface Mount
OperatingTemperature 0°C ~ 100°C (TJ)
Package/Case 900-BBGA, FCBGA

Übersicht

Description

The XCKU11P-2FFVD900E is a high-performance FPGA (Field-Programmable Gate Array) from Xilinx's Kintex UltraScale family. Designed for data-intensive applications, it features a robust architecture that supports advanced functionalities like parallel processing, high-speed serial connectivity, and extensive I/O capabilities.
Key specifications include 11,500 logic cells, 36 DSP slices for efficient signal processing, and up to 900K configurable logic gates. Its 2D architecture enables enhanced performance for complex algorithms used in applications like machine learning, video processing, and telecommunications.
The device operates at high speeds and supports various protocols, making it suitable for industries such as aerospace, automotive, and networking. Additionally, it comes with programmable logic, allowing users to tailor the hardware to specific needs. The XCKU11P-2FFVD900E is ideal for engineers seeking flexibility and efficiency in custom hardware designs.

Features

The XCKU11P-2FFVD900E is a part of Xilinx's Kintex UltraScale FPGA family, designed for high-performance applications. Key features include:
1. Architecture: 11K logic cells with advanced 28nm process technology, offering a balance of performance and power efficiency.
2. DSP Slices: Equipped with 120 DSP slices, enabling efficient digital signal processing.
3. Memory: Includes up to 7.2 Mb of Block RAM and support for various types of memory interfaces.
4. I/O: Supports up to 540 user I/O pins, with capabilities for high-speed transceivers (up to 12.5 Gbps).
5. Flexibility: Ideal for applications in telecommunications, automotive, aerospace, and industrial control systems.
6. Power: Lower power consumption compared to previous generations, making it suitable for portable and energy-sensitive applications.
7. Tools: Compatible with Xilinx Vivado Design Suite for efficient design and debugging.
Overall, the XCKU11P-2FFVD900E combines high logic density, extensive I/O capabilities, and advanced processing features, catering to demanding applications in various industries.

Package

The XCKU11P-2FFVD900E is packaged in a FFG (Fine Pitch Flip Chip) form factor with a ball grid array (BGA) configuration, specifically FFVD900. This package type offers high-density I/O and efficient thermal management suitable for high-performance applications in FPGAs.

Pinout

The Xilinx XCKU11P-2FFVD900E is a part of the Kintex UltraScale FPGA family. It features a pin count of 900 pins.
The functions of these pins include various I/O capabilities, power supply connections, and configuration interfaces. The device supports high-speed serial transceivers, general-purpose I/Os, and dedicated clock management inputs. The pins are organized to facilitate various functions such as logic I/O, configuration, and power management.
Overall, the diverse functionality of the pins enables the implementation of complex digital designs for applications in areas like telecommunications, automotive, and data processing.

Manufacturer

The manufacturer of the XCKU11P-2FFVD900E is Xilinx, Inc., which is now part of AMD (Advanced Micro Devices). Xilinx is a leading technology company specializing in the design and production of programmable logic devices, such as FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and ACAPs (Adaptive Compute Acceleration Platforms). Founded in 1984, Xilinx played a pioneering role in the development of FPGAs, enabling engineers to create customized hardware solutions for a wide array of applications, including telecommunications, automotive, aerospace, and data centers. Their products provide flexibility and efficiency in hardware design, catering to both high-performance computing and low-power applications. In early 2022, AMD completed its acquisition of Xilinx, enhancing its portfolio in the field of adaptive computing technologies.

Application

The XCKU11P-2FFVD900E is a high-performance FPGA from Xilinx's Kintex UltraScale+ family. It is commonly used in applications such as high-speed data processing, telecommunications, aerospace and defense, machine learning, video processing, and industrial automation. Its flexibility and processing power make it suitable for tasks requiring real-time computation and complex algorithms, such as video transcoding, network packet processing, and digital signal processing.

Equivalent

The XCKU11P-2FFVD900E is a Kintex UltraScale FPGA. Equivalent products include the Xilinx Kintex UltraScale XCKU15P, XCKU19P, and other Kintex UltraScale variants with similar capabilities and logic resource counts. For more specific alternatives, consider devices from other series like Xilinx Virtex or other manufacturers such as Intel (formerly Altera), which offer comparable FPGAs like the Arria 10 series. Always check specific requirements and performance specifications for suitable replacements.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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