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XCKU13P-2FFVE900I
IC FPGA 304 I/O 900FCBGA
- Hersteller
- Fr. Teil #XCKU13P-2FFVE900I
- Paket FBGA-900
- Datenblatt
- Auf Lager4532
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Spezifikationen
| Package | Tray |
| Series | Kintex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 42660 |
| NumberofLogicElements/Cells | 746550 |
| TotalRAMBits | 70656000 |
| NumberofI/O | 304 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 900-BBGA, FCBGA |
Übersicht
Description
This FPGA is ideal for applications requiring high throughput and low latency, such as telecommunications, data centers, automotive systems, and machine learning. It supports high-speed transceivers capable of achieving data rates up to 28 Gbps, facilitating efficient data transfer. The device is housed in a compact FFG900 package, making it suitable for space-constrained designs.
XCKU13P-2FFVE900I is programmable via the Vivado Design Suite, enabling efficient design, simulation, and synthesis workflows. Its reliability and scalability make it a preferred choice for engineers aiming to create innovative solutions in diverse industries.
Features
- Architecture: Supports the UltraScale architecture for improved performance and efficiency.
- Logic Cells: Approximately 13,000 logic cells for complex logic implementation.
- DSP Slices: Up to 1,440 DSP slices for high-speed arithmetic operations, ideal for digital signal processing applications.
- Memory: Up to 1.5 MB of block RAM and support for ultra-high-speed serial transceivers.
- I/O Capabilities: Flexible I/O options, including high-speed transceivers (up to 28 Gbps).
- Power Efficiency: Optimized for lower power consumption while delivering high performance.
- Configuration: Supports various configuration modes and interfaces, including JTAG and SPI.
- Applications: Suitable for data centers, wireless communications, video processing, and embedded systems.
Overall, the XCKU13P-2FFVE900I balances high performance with versatility, making it ideal for demanding applications in various industries.
Package
Pinout
- Configurable I/O: Supports various I/O standards.
- High-speed transceivers: Up to 32 Gbps data rates for high-performance applications.
- Digital signal processing (DSP) slices: Designed for complex computations.
- Memory interfaces: Supports external memory connectivity.
- Power management: Offers features for efficient power consumption.
This FPGA is suitable for a wide range of applications, including telecommunications, data centers, and industrial automation, thanks to its flexibility and performance.
Manufacturer
Application
Equivalent
1. XCKU13P-2FFVE900C
2. XCKU13P-2FFVB900I
3. XCKU13P-2FFVB900C
These alternatives offer similar functionalities but may vary in features like temperature range and packaging. Always check specific requirements for compatibility.
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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