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XCKU15P-L2FFVA1156E
IC FPGA 516 I/O 1156FCBGA
- Hersteller
- Fr. Teil #XCKU15P-L2FFVA1156E
- Paket FCBGA-1156
- Datenblatt
- Auf Lager5743
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Spezifikationen
| Package | Tray |
| Series | Kintex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 65340 |
| NumberofLogicElements/Cells | 1143450 |
| TotalRAMBits | 82329600 |
| NumberofI/O | 516 |
| Voltage-Supply | 0.698V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 1156-BBGA, FCBGA |
Übersicht
Description
The "L2" designation indicates a specific logic and routing architecture optimized for low power consumption while maintaining performance. The "FFVA1156E" package refers to its physical form factor, which supports efficient thermal management and integration into various systems.
Due to its capabilities, the XCKU15P is widely used in industries such as telecommunications, automotive, aerospace, and military, enabling rapid prototyping and deployment of advanced technologies. Its programmable nature allows for customization to meet specific application requirements, ensuring versatility and future-proofing in rapidly evolving markets.
Features
1. Logic Cells: Approximately 15,000 logic cells for complex digital designs.
2. DSP Slices: Contains 30 DSP slices optimized for high-speed arithmetic operations.
3. Memory: Includes multiple Block RAMs (BRAM) and UltraRAM for efficient data storage.
4. I/O: Supports a variety of high-speed serial interfaces, including PCIe Gen3 and high-speed transceivers (up to 6.6 Gbps).
5. Power Efficiency: Designed for low power consumption, making it suitable for power-sensitive applications.
6. Configuration: Flexible configuration options for various application needs, including partial reconfiguration.
7. Development Tools: Compatible with Xilinx development environments like Vivado, enabling efficient design and implementation.
This FPGA is ideal for applications in telecommunications, automotive, aerospace, and industrial sectors, where performance and flexibility are critical.
Package
Pinout
- Configurable I/O standards (e.g., LVDS, LVCMOS)
- High-speed serial transceivers
- Multiple configurable logic blocks
- DSP slices and memory resources
These functionalities make it suitable for a variety of applications, including data processing, high-speed networking, and signal processing. The device supports advanced power management and can be used in various industrial, telecommunications, and automotive applications.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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