XCKU3P-1FFVB676I

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XCKU3P-1FFVB676I

IC FPGA 280 I/O 676FCBGA

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  • Fr. Teil #XCKU3P-1FFVB676I
  • Paket FBGA-676
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Spezifikationen

Package Tray
Series Kintex® UltraScale+™
ProductStatus Active
NumberofLABs/CLBs 20340
NumberofLogicElements/Cells 355950
TotalRAMBits 31641600
NumberofI/O 280
Voltage-Supply 0.825V ~ 0.876V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 676-BBGA, FCBGA

Übersicht

Description

The XCKU3P-1FFVB676I is a high-performance FPGA (Field-Programmable Gate Array) from Xilinx's Kintex UltraScale+ series. It features a 676-ball FCBGA (Fine Pitch Ball Grid Array) package and is designed for applications requiring significant processing power and flexibility. The device offers a range of capabilities including high-speed serial interfaces, DSP slices, and extensive I/O options, making it suitable for applications in telecommunications, automotive, aerospace, and industrial automation.
With a low power consumption profile, the XCKU3P-1FFVB676I supports advanced features like partial reconfiguration and dynamic voltage scaling, enhancing its efficiency and adaptability. It operates at a maximum clock frequency of 600 MHz and provides substantial logic resources, including thousands of logic cells and configurable I/O blocks. The Kintex UltraScale+ architecture leverages 16nm FinFET technology, resulting in improved performance-per-watt compared to previous generations. This makes the XCKU3P-1FFVB676I an ideal choice for developers seeking to implement complex algorithms and data processing tasks in a customizable hardware platform.

Features

The Xilinx XCKU3P-1FFVB676I is a member of the Kintex UltraScale series of FPGAs. Key features include:
1. Logic Cells: Approximately 102,000 logic cells for high-performance computing.
2. DSP Slices: 300+ DSP slices for efficient digital signal processing capabilities.
3. Memory: Supports over 5.5 Mbits of block RAM and 512 Kbits of distributed RAM.
4. I/O Capabilities: Features up to 60 LVDS I/O pairs and supports various I/O standards, including LVDS, LVCMOS, and more.
5. Clock Management: Integrated clock management features, including MMCMs (Mixed-Mode Clock Managers) and PLLs (Phase-Locked Loops).
6. Power Consumption: Designed for lower power usage while providing high performance.
7. Package Type: Comes in a 676-ball FBG676 package, suitable for various applications.
8. Applications: Ideal for high-speed serial connectivity, video processing, and data acquisition tasks.
These features make it suitable for demanding applications in telecommunications, aerospace, and industrial automation.

Package

The XCKU3P-1FFVB676I is a Field-Programmable Gate Array (FPGA) from Xilinx's Kintex UltraScale series, packaged in a 676-ball FCBGA (Fine-Pitch Ball Grid Array) configuration. This type of package allows for high-density connections and efficient thermal management.

Pinout

The XCKU3P-1FFVB676I is part of the Xilinx Kintex UltraScale FPGA family. It features a pin count of 676.
The primary functions of this FPGA include high-performance digital signal processing, data processing, and various high-speed communication applications. The device integrates a range of programmable logic resources, including configurable logic blocks (CLBs), digital signal processing (DSP) slices, block RAM (BRAM), and high-speed transceivers. It is designed for applications in areas such as telecommunications, automotive, and data center processing, providing flexibility and scalability for complex designs.
Additionally, it supports multiple I/O standards, enabling connectivity with various external devices and systems.

Manufacturer

The XCKU3P-1FFVB676I is manufactured by Xilinx, Inc., a company known for its production of programmable logic devices, including FPGAs (Field-Programmable Gate Arrays), SoCs (System on Chips), and other related technologies. Xilinx specializes in providing solutions for a wide range of applications, including telecommunications, automotive, aerospace, and industrial sectors. The company is recognized for its innovative approach to enabling programmable hardware, allowing engineers to design customized hardware solutions tailored to specific needs. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities in the semiconductor industry.

Application

The XCKU3P-1FFVB676I is a versatile FPGA from Xilinx's Kintex UltraScale+ series, commonly used in applications such as high-performance computing, data center acceleration, telecommunications, aerospace and defense, and video processing. It is suitable for tasks requiring high throughput, low latency, and customizable logic, making it ideal for prototyping, signal processing, and machine learning applications.

Equivalent

The XCKU3P-1FFVB676I is a Kintex UltraScale FPGA from Xilinx. Equivalent products include the Intel Arria 10 GX FPGA and the Lattice ECP5 FPGA series. For direct replacements, consider other Kintex UltraScale models like XCKU3P-2FFVB676 or similar FPGAs in the Kintex family. Always verify specific performance, I/O capabilities, and power requirements based on your application needs.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

Zahlungen

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