XCKU3P-2FFVA676I

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XCKU3P-2FFVA676I

IC FPGA 256 I/O 676FCBGA

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Spezifikationen

Series Kintex® UltraScale+™
Part Status Active
Base Product Number XCKU3
DigiKey Programmable Not Verified
Number of LABs/CLBs 20340
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 256
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Packaging Tray

Übersicht

Description

The XCKU3P-2FFVA676I is a field-programmable gate array (FPGA) from Xilinx's Kintex UltraScale+ series. It is designed for high-performance applications requiring extensive processing capabilities, such as data centers, telecommunications, and automotive systems.
Key features include:
1. Architecture: Utilizes a 16nm FinFET process technology, providing improved performance and power efficiency.
2. Logic Cells: Contains over 300,000 logic cells, enabling complex designs and computations.
3. Memory: Supports large amounts of embedded memory, including block RAM and UltraRAM, for efficient data handling.
4. I/O and Connectivity: Offers numerous high-speed transceivers and versatile I/O options for integrating with various peripherals and communication protocols.
5. Development Environment: Compatible with Xilinx’s Vivado Design Suite, which facilitates design, simulation, and implementation processes.
Overall, the XCKU3P-2FFVA676I is suitable for applications that demand high throughput and low latency, making it a popular choice among developers and engineers in advanced computing fields.

Features

The XCKU3P-2FFVA676I is a member of the Xilinx Kintex UltraScale FPGA family, designed for high-performance applications. Key features include:
1. Logic Cells: It contains approximately 215,360 logic cells, providing ample resources for complex algorithms and data processing.

2. DSP Slices: Equipped with 840 DSP slices, suitable for high-speed signal processing tasks.
3. Block RAM: Features 18.4 Mb of block RAM, which supports data storage and buffering functions.
4. I/O Capabilities: Up to 384 user I/O pins, supporting various voltage standards for flexibility in interfacing with other components.
5. Transceivers: Includes 16 multi-gigabit transceivers (MGTs) supporting data rates up to 28.5 Gbps, ideal for high-speed data communication.
6. Power: Offers low power consumption, making it suitable for power-sensitive applications.
7. Development Tools: Compatible with Xilinx Vivado Design Suite, enabling efficient design and debugging workflows.
This FPGA is well-suited for applications in telecommunications, data center, and embedded systems.

Package

The XCKU3P-2FFVA676I is packaged in a Fine-Pitch Ball Grid Array (FBGA) format, specifically with 676 balls. This package type provides efficient thermal performance and space-saving design, suitable for high-density applications in field-programmable gate arrays (FPGAs).

Pinout

The XCKU3P-2FFVA676I is part of the Xilinx Kintex UltraScale FPGA family, featuring a pin count of 676. This device is designed for high-performance applications and offers a range of functionalities, including high-speed serial I/O, programmable logic, and extensive memory interfaces. The FPGA is suitable for applications in communications, data center, automotive, and industrial sectors, providing flexibility in digital design and implementation. It supports various protocols and has capabilities for advanced signal processing and high bandwidth requirements.

Manufacturer

The XCKU3P-2FFVA676I is manufactured by Xilinx, Inc., a company that specializes in the development of programmable logic devices, including FPGAs (Field Programmable Gate Arrays), SoCs (System on Chips), and other related technologies. Xilinx is known for its innovative contributions to the semiconductor industry, particularly in providing solutions for a wide range of applications such as data centers, automotive, aerospace, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in high-performance computing and adaptive computing solutions.

Application

The XCKU3P-2FFVA676I is a versatile FPGA from Xilinx's Kintex UltraScale series, suitable for various applications including digital signal processing, high-performance computing, machine learning, data center acceleration, video processing, and telecommunications. Its capabilities make it ideal for use in automotive, aerospace, industrial automation, and medical imaging, where flexibility and high-speed data handling are essential.

Equivalent

The XCKU3P-2FFVA676I is a Xilinx Kintex UltraScale FPGA. Equivalent products include other FPGAs from the Kintex UltraScale family, such as the XCKU3P-2FFVA676, XCKU3P-2FFVB676, and XCKU3P-2FFVC676. Alternatives from other families include Intel (Altera) Arria 10 or Lattice ECP5 series, depending on specific requirements like logic density, power consumption, and performance. Always verify compatibility with specifications and application needs.

Versand

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Versandgebührenreferenz (DHL/FedEx):

DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.

von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.

Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

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