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XCKU3P-2FFVA676I
IC FPGA 256 I/O 676FCBGA
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Spezifikationen
| Series | Kintex® UltraScale+™ |
| Part Status | Active |
| Base Product Number | XCKU3 |
| DigiKey Programmable | Not Verified |
| Number of LABs/CLBs | 20340 |
| Number of Logic Elements/Cells | 355950 |
| Total RAM Bits | 31641600 |
| Number of I/O | 256 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Packaging | Tray |
Übersicht
Description
Key features include:
1. Architecture: Utilizes a 16nm FinFET process technology, providing improved performance and power efficiency.
2. Logic Cells: Contains over 300,000 logic cells, enabling complex designs and computations.
3. Memory: Supports large amounts of embedded memory, including block RAM and UltraRAM, for efficient data handling.
4. I/O and Connectivity: Offers numerous high-speed transceivers and versatile I/O options for integrating with various peripherals and communication protocols.
5. Development Environment: Compatible with Xilinx’s Vivado Design Suite, which facilitates design, simulation, and implementation processes.
Overall, the XCKU3P-2FFVA676I is suitable for applications that demand high throughput and low latency, making it a popular choice among developers and engineers in advanced computing fields.
Features
1. Logic Cells: It contains approximately 215,360 logic cells, providing ample resources for complex algorithms and data processing.
2. DSP Slices: Equipped with 840 DSP slices, suitable for high-speed signal processing tasks.
3. Block RAM: Features 18.4 Mb of block RAM, which supports data storage and buffering functions.
4. I/O Capabilities: Up to 384 user I/O pins, supporting various voltage standards for flexibility in interfacing with other components.
5. Transceivers: Includes 16 multi-gigabit transceivers (MGTs) supporting data rates up to 28.5 Gbps, ideal for high-speed data communication.
6. Power: Offers low power consumption, making it suitable for power-sensitive applications.
7. Development Tools: Compatible with Xilinx Vivado Design Suite, enabling efficient design and debugging workflows.
This FPGA is well-suited for applications in telecommunications, data center, and embedded systems.
Package
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Manufacturer
Application
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Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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