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XCKU3P-2FFVB676E
IC FPGA 280 I/O 676FCBGA
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- Fr. Teil #XCKU3P-2FFVB676E
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Spezifikationen
| Series | Kintex® UltraScale+™ |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 355950 |
| Total RAM Bits | 31641600 |
| Number of I/O | 280 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Package / Case | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27x27) |
| Base Product Number | XCKU3 |
| Number of LABs/CLBs | 20340 |
Übersicht
Description
The "2" in the part number indicates a specific performance grade, while "FFVB676" denotes its package type and pin count, which is a 676-ball FFG package. The XCKU3P is known for its scalability and flexibility, enabling designers to implement custom hardware accelerators, digital signal processing, and complex algorithms efficiently.
Key features include high-speed transceivers, extensive memory resources, and support for various high-level design tools, making it easier for developers to create innovative solutions. The device also supports multiple communication protocols, enhancing its adaptability for different applications. Overall, the XCKU3P-2FFVB676E is ideal for engineers looking to leverage advanced FPGA technology for demanding project requirements.
Features
1. Logic Cells: Approximately 54,000 logic cells, providing high-density logic solutions.
2. DSP Slices: Integrated DSP slices for efficient digital signal processing, with up to 220 DSP slices available.
3. Block RAM: Supports up to 4.2 Mb of block RAM for flexible memory configurations.
4. Transceivers: Features high-speed serial transceivers supporting data rates up to 12.5 Gbps, facilitating high-bandwidth communication.
5. I/O Support: 676 package with versatile I/O capabilities, including LVDS and other standards.
6. Configuration Options: Multiple configuration methods, including JTAG and SPI.
7. Power Efficiency: Optimized for low power consumption while delivering high performance.
Ideal for applications in telecommunications, automotive, and data centers, the XCKU3P-2FFVB676E balances performance and efficiency, making it suitable for complex computational tasks.
Package
Pinout
The pin functions vary widely and include power supply pins, ground pins, I/O pins, and dedicated function pins for configuration, clock inputs, and high-speed transceivers. The I/O pins can be configured for various standards and protocols, making the FPGA versatile for different applications.
This FPGA is well-suited for applications requiring high performance and flexibility, such as digital signal processing, data center acceleration, and high-speed communication.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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