XCKU3P-2FFVB676E

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XCKU3P-2FFVB676E

IC FPGA 280 I/O 676FCBGA

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Spezifikationen

Series Kintex® UltraScale+™
Part Status Active
DigiKey Programmable Not Verified
Number of Logic Elements/Cells 355950
Total RAM Bits 31641600
Number of I/O 280
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 100°C (TJ)
Package / Case 676-BBGA, FCBGA
Supplier Device Package 676-FCBGA (27x27)
Base Product Number XCKU3
Number of LABs/CLBs 20340

Übersicht

Description

The Xilinx XCKU3P-2FFVB676E is a versatile FPGA (Field Programmable Gate Array) belonging to the Kintex UltraScale family. Designed for high-performance applications, it features 3,840 logic cells, integrated DSP slices, and a range of I/O capabilities. This FPGA is suitable for applications in telecommunications, automotive, aerospace, and data centers, thanks to its high bandwidth and low power consumption.
The "2" in the part number indicates a specific performance grade, while "FFVB676" denotes its package type and pin count, which is a 676-ball FFG package. The XCKU3P is known for its scalability and flexibility, enabling designers to implement custom hardware accelerators, digital signal processing, and complex algorithms efficiently.
Key features include high-speed transceivers, extensive memory resources, and support for various high-level design tools, making it easier for developers to create innovative solutions. The device also supports multiple communication protocols, enhancing its adaptability for different applications. Overall, the XCKU3P-2FFVB676E is ideal for engineers looking to leverage advanced FPGA technology for demanding project requirements.

Features

The XCKU3P-2FFVB676E is a part of Xilinx's Kintex UltraScale family, designed for high-performance applications. Key features include:
1. Logic Cells: Approximately 54,000 logic cells, providing high-density logic solutions.
2. DSP Slices: Integrated DSP slices for efficient digital signal processing, with up to 220 DSP slices available.
3. Block RAM: Supports up to 4.2 Mb of block RAM for flexible memory configurations.
4. Transceivers: Features high-speed serial transceivers supporting data rates up to 12.5 Gbps, facilitating high-bandwidth communication.
5. I/O Support: 676 package with versatile I/O capabilities, including LVDS and other standards.
6. Configuration Options: Multiple configuration methods, including JTAG and SPI.
7. Power Efficiency: Optimized for low power consumption while delivering high performance.
Ideal for applications in telecommunications, automotive, and data centers, the XCKU3P-2FFVB676E balances performance and efficiency, making it suitable for complex computational tasks.

Package

The XCKU3P-2FFVB676E is packaged in a Fine Flip Chip Ball Grid Array (FFBGA) format with 676 balls. This package type provides a compact design suitable for high-density applications, facilitating efficient thermal and electrical performance.

Pinout

The XCKU3P-2FFVB676E is a field-programmable gate array (FPGA) from Xilinx's Kintex UltraScale series. It features a total of 676 pins.
The pin functions vary widely and include power supply pins, ground pins, I/O pins, and dedicated function pins for configuration, clock inputs, and high-speed transceivers. The I/O pins can be configured for various standards and protocols, making the FPGA versatile for different applications.
This FPGA is well-suited for applications requiring high performance and flexibility, such as digital signal processing, data center acceleration, and high-speed communication.

Manufacturer

The manufacturer of the XCKU3P-2FFVB676E is Xilinx, Inc., which is now part of AMD (Advanced Micro Devices). Xilinx is known for its development of field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and adaptive computing solutions. The company specializes in providing programmable hardware that allows engineers to create customized solutions for a wide range of applications, including telecommunications, automotive, aerospace, and industrial automation. Xilinx’s products are widely used in high-performance computing and data center applications, contributing to advancements in artificial intelligence, machine learning, and other emerging technologies.

Application

The XCKU3P-2FFVB676E is a versatile FPGA from the Xilinx Kintex UltraScale+ family, suitable for applications such as telecommunications, data centers, high-performance computing, automotive systems, industrial automation, and embedded systems. Its high processing power and flexible I/O capabilities make it ideal for tasks like signal processing, machine learning, and real-time data analysis.

Equivalent

The XCKU3P-2FFVB676E is a Kintex UltraScale FPGA from Xilinx. Equivalent products include the Intel (Altera) Arria 10 series, such as the Arria 10 GX 10AS027, and other FPGAs from the Lattice ECP5 series. However, direct equivalents may vary based on specific application needs, performance, and features. Always verify compatibility and requirements for your specific use case.

Versand

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von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.

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Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.

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