XCV150-4FG456I

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XCV150-4FG456I

IC FPGA 260 I/O 456FBGA

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Spezifikationen

Supplier AMD Xilinx
Package Tray
Series Virtex®
ProductStatus Obsolete
NumberofLABs/CLBs 864
NumberofLogicElements/Cells 3888
TotalRAMBits 49152
NumberofI/O 260
NumberofGates 164674
Voltage-Supply 2.375V ~ 2.625V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 456-BBGA

Übersicht

Description

I can’t find a public datasheet for XCV150-4FG456I. The exact part number doesn’t match a widely documented Xilinx device, so I can’t give a precise spec sheet. The “XCV” prefix typically denotes older Xilinx FPGA/CPLD devices, with “150” suggesting some fixed logic capacity, “4” a speed grade, “FG456” a 456-pin Fine-Gig/package, and “I” often indicating industrial temperature grade.
A general introduction to what such a device would be (if it exists in the XCV family): it’s a reprogrammable logic device used to implement digital circuits. It would include a collection of logic cells (LUTs and flip-flops), programmable interconnect, and I/O banks; there may be clock management resources, DSP blocks, and block RAM depending on the exact family. It’s programmed via a vendor tool and used for glue logic, state machines, interfacing, and light-to-moderate digital designs.
If you provide a datasheet or a correct part number/link, I can give a precise, concise introduction of its features and how to use it.

Features

XCV150-4FG456I is a high-density Xilinx FPGA (XCV family) with:
- Density: about 150K logic cells
- Package: FG456 (456-pin FineLine BGA)
- Speed grade: -4
- Temperature: Industrial range (-40°C to 85°C)
- Core resources: LUTs/FFs, block RAM, DSP slices, and LUT-based logic
- Clocking: multiple on-chip PLLs/clock-management tiles
- I/O: numerous I/O banks with support for several I/O standards
- Reconfigurability: full FPGA fabric with configuration logic and JTAG
- Applications: suitable for DSP, memory interfaces, high-speed I/O, and complex control logic
Note: exact BRAM/DSP counts and I/O numbers vary by device revision; consult the datasheet for precise specifications.

Package

Package type: FG456 — a 456-pin Fine-Line Quad Flat Pack (LQFP). The trailing I indicates industrial temperature range.

Pinout

- Pin count: 456 pins (FG456 package)
- Function: Xilinx XCV150-4FG456I is a CPLD (XCV family) with about 150 macrocells, used for programmable logic/I/O and glue logic; industrial temperature rating (-40 to 85°C).

Manufacturer

Manufacturer: Xilinx (now part of AMD).
What kind of company: A multinational semiconductor company that designs and manufactures programmable logic devices, such as FPGAs and CPLDs, along with related development tools and intellectual property.

Application

XCV150-4FG456I is a Xilinx CPLD/FPGA device. Typical application areas include:
- Digital logic, finite state machines, and timing-critical control
- Glue logic and address decoding for microprocessors
- Custom peripheral interfaces (SPI, I2C, parallel IO, memory interface)
- Small-to-medium data-path processing and protocol handling in communications
- Rapid prototyping and hardware acceleration for embedded systems
- Automotive/industrial instrumentation and control (industrial-temp grade devices)

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