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XCV600E-6FG676C
IC FPGA 444 I/O 676FCBGA
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- Fr. Teil #XCV600E-6FG676C
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- Datenblatt XCV600E-6FG676C DataSheet
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Spezifikationen
| Series | Virtex®-E |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 294912 |
| Number of I/O | 444 |
| Number of Gates | 985882 |
| Voltage - Supply | 1.71V ~ 1.89V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
| Base Product Number | XCV600E |
| Number of Logic Elements/Cells | 15552 |
| Number of LABs/CLBs | 3456 |
Übersicht
Description
Key specifications include 6-input look-up tables (LUTs), a rich set of programmable interconnect resources, and integrated digital signal processing (DSP) blocks. The device is housed in a 676-ball fine-pitch ball grid array (FBGA) package, which facilitates effective thermal and electrical performance.
The XCV600E is ideal for applications such as telecommunications, image processing, and high-speed data acquisition, enabling rapid prototyping and time-to-market advantages. Its reconfigurable nature allows engineers to implement custom logic and adapt designs as requirements change, enhancing design efficiency.
Features
1. Logic Cells: Approximately 600,000 system gates with a combination of configurable logic blocks (CLBs) and dedicated hardware features.
2. I/O Pins: 676 pins with support for various I/O standards, enabling flexible interfacing.
3. Block RAM: Embedded block RAM providing high-speed memory for data storage and processing.
4. DSP Slices: Contains dedicated DSP slices for efficient digital signal processing, suitable for high-performance applications.
5. Configuration: Supports multiple configuration methods including JTAG and serial modes.
6. Clock Management: Features integrated clock management tiles for enhanced timing control and reduced skew.
7. High Speed: Capable of high-speed operation with a maximum clock frequency of over 300 MHz.
8. Development Tools: Compatible with Xilinx development environments such as Vivado and ISE for design and simulation.
This FPGA is suitable for applications in telecommunications, automotive, and industrial control systems due to its flexibility and processing power.
Package
Pinout
The primary functions of the pins include:
1. I/O Pins: Used for input and output operations, allowing the FPGA to interface with other devices.
2. Power Pins: Provide the necessary voltage and ground connections for the FPGA's operation.
3. Configuration Pins: Allow the FPGA to be programmed and configured at power-up.
4. Clock Pins: Used for receiving clock signals, essential for synchronous operation.
5. JTAG Pins: Facilitate boundary scan and in-system programming.
This FPGA is designed for high-performance applications, offering a range of logic resources, memory, and support for various communication standards.
Manufacturer
In 2020, Xilinx was acquired by AMD (Advanced Micro Devices, Inc.), enhancing its capabilities in high-performance computing and deepening its involvement in AI and machine learning applications. The XCV600E-6FG676C specifically is part of the Virtex series, aimed at offering high performance and flexibility for demanding applications.
Application
Equivalent
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Zahlungen
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