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XCVU13P-2FHGA2104E
IC FPGA 832 I/O 2104FCBGA
- Hersteller
- Fr. Teil #XCVU13P-2FHGA2104E
- Paket FBGA-2104
- Datenblatt
- Auf Lager3879
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Spezifikationen
| Package | Tray |
| Series | Virtex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 216000 |
| NumberofLogicElements/Cells | 3780000 |
| TotalRAMBits | 514867200 |
| NumberofI/O | 832 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 100°C (TJ) |
| Package/Case | 2104-BBGA, FCBGA |
Übersicht
Description
Key specifications include:
- Logic Cells: It offers a large number of configurable logic cells, enabling complex designs.
- Memory: The device includes significant on-chip memory resources, enhancing data handling capabilities.
- I/O Capabilities: It supports various high-speed interfaces, allowing for versatile connectivity options.
- Power Efficiency: Designed for low-power operation, it enables high performance with reduced energy consumption.
- 400G Ethernet and PCIe Support: It is well-suited for applications requiring high bandwidth and fast data transfer.
The XCVU13P is particularly suitable for edge computing, AI inference, and large-scale telecom processing. Its programmability allows for customization, making it a popular choice for engineers looking to implement specific functionalities in hardware.
Features
1. Architecture: Utilizes a 16nm FinFET process technology, enabling higher performance and lower power consumption.
2. Logic Cells: Offers up to 1.5 million logic cells, suitable for complex designs and applications.
3. DSP Slices: Includes around 8,000 DSP slices, ideal for signal processing tasks.
4. Memory: Provides extensive on-chip memory options, including block RAM (BRAM) and UltraRAM for enhanced data handling capabilities.
5. I/O: Supports high-speed I/O interfaces, including PCIe Gen4, featuring up to 32 lanes for rapid data transfer.
6. Connectivity: Integrated high-speed transceivers capable of 28 Gbps for reliable communication.
7. Design Flexibility: Supports various design methodologies, including RTL, C/C++, and high-level synthesis (HLS).
8. Power Efficiency: Designed for optimized power management, suitable for both performance-intensive and power-sensitive applications.
Overall, the XCVU13P-2FHGA2104E is engineered for advanced computing tasks in data centers, telecommunications, and industrial applications.
Package
Pinout
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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