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XCVU13P-2FHGA2104I
IC FPGA 832 I/O 2104FCBGA
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Spezifikationen
| Series | Virtex® UltraScale+™ |
| Part Status | Active |
| DigiKey Programmable | Not Verified |
| Number of Logic Elements/Cells | 3780000 |
| Total RAM Bits | 514867200 |
| Number of I/O | 832 |
| Voltage - Supply | 0.825V ~ 0.876V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 2104-BBGA, FCBGA |
| Supplier Device Package | 2104-FCBGA (52.5x52.5) |
| Base Product Number | XCVU13 |
| Number of LABs/CLBs | 216000 |
Übersicht
Description
Key specifications include:
- Logic Cells: Approximately 1.5 million logic cells for extensive design flexibility.
- DSP Slices: Enhanced DSP capabilities for high-speed, efficient processing of complex algorithms.
- Memory Interfaces: Support for various memory interfaces, enabling high-bandwidth data handling.
- Power Efficiency: Designed for optimized power consumption while delivering high performance, suitable for applications in data centers, telecommunications, and automotive industries.
The device is programmed using VHDL, Verilog, or higher-level languages like C/C++ with Xilinx development tools, making it suitable for a wide range of applications, including AI inference, signal processing, and custom logic implementations. Its versatility and performance make it a popular choice among engineers and developers in cutting-edge technology sectors.
Features
1. Architecture: Utilizes a 16nm process technology for enhanced performance and power efficiency.
2. Logic Elements: Offers a substantial number of configurable logic blocks (CLBs), enabling complex designs.
3. DSP Slices: Equipped with a large number of DSP slices, ideal for signal processing applications.
4. Memory: Integrated high-bandwidth memory options, including UltraRAM and Block RAM.
5. I/O Support: Supports a wide range of I/O standards and high-speed transceivers for extensive connectivity.
6. Configuration: Features a fast configuration interface, allowing for quick setup of the device.
7. Power Management: Advanced power management capabilities to optimize energy consumption.
8. Scalability: Designed for scalability, suitable for applications in data centers, AI/ML, and high-performance computing.
These attributes make the XCVU13P-2FHGA2104I suitable for demanding applications in various industries.
Package
Pinout
The functions of these pins include a variety of I/O capabilities, power, ground connections, and dedicated configuration and clock pins. Specifically, the pins can be configured for user-defined I/O standards, supporting various protocols and interfaces such as LVDS, PCIe, and Ethernet. Additionally, it has dedicated pins for configuration and management functions, including JTAG, and multi-gigabit transceivers (MGTs) for high-speed data transmission. The FPGA can also interface with memory and other peripherals through its programmable I/O resources.
Manufacturer
Application
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Zahlungen
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