XCVU13P-2FHGA2104I

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XCVU13P-2FHGA2104I

IC FPGA 832 I/O 2104FCBGA

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Spezifikationen

Series Virtex® UltraScale+™
Part Status Active
DigiKey Programmable Not Verified
Number of Logic Elements/Cells 3780000
Total RAM Bits 514867200
Number of I/O 832
Voltage - Supply 0.825V ~ 0.876V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 2104-BBGA, FCBGA
Supplier Device Package 2104-FCBGA (52.5x52.5)
Base Product Number XCVU13
Number of LABs/CLBs 216000

Übersicht

Description

The XCVU13P-2FHGA2104I is a high-performance FPGA (Field-Programmable Gate Array) from Xilinx's Versal ACAP (Adaptive Compute Acceleration Platform) series. It features advanced heterogeneous computing capabilities, integrating multiple processing elements such as FPGA fabric, AI engines, and digital signal processing (DSP) resources.
Key specifications include:
- Logic Cells: Approximately 1.5 million logic cells for extensive design flexibility.
- DSP Slices: Enhanced DSP capabilities for high-speed, efficient processing of complex algorithms.
- Memory Interfaces: Support for various memory interfaces, enabling high-bandwidth data handling.
- Power Efficiency: Designed for optimized power consumption while delivering high performance, suitable for applications in data centers, telecommunications, and automotive industries.
The device is programmed using VHDL, Verilog, or higher-level languages like C/C++ with Xilinx development tools, making it suitable for a wide range of applications, including AI inference, signal processing, and custom logic implementations. Its versatility and performance make it a popular choice among engineers and developers in cutting-edge technology sectors.

Features

The XCVU13P-2FHGA2104I is a high-performance FPGA (Field-Programmable Gate Array) from Xilinx's UltraScale+ family. Key features include:
1. Architecture: Utilizes a 16nm process technology for enhanced performance and power efficiency.
2. Logic Elements: Offers a substantial number of configurable logic blocks (CLBs), enabling complex designs.
3. DSP Slices: Equipped with a large number of DSP slices, ideal for signal processing applications.
4. Memory: Integrated high-bandwidth memory options, including UltraRAM and Block RAM.
5. I/O Support: Supports a wide range of I/O standards and high-speed transceivers for extensive connectivity.
6. Configuration: Features a fast configuration interface, allowing for quick setup of the device.
7. Power Management: Advanced power management capabilities to optimize energy consumption.
8. Scalability: Designed for scalability, suitable for applications in data centers, AI/ML, and high-performance computing.
These attributes make the XCVU13P-2FHGA2104I suitable for demanding applications in various industries.

Package

The XCVU13P-2FHGA2104I is packaged in a Flip-Chip Ball Grid Array (FCBGA) format. This type of package features a grid of solder balls on the underside for surface mounting, allowing for high density and improved thermal performance.

Pinout

The XCVU13P-2FHGA2104I is a member of the Xilinx Virtex UltraScale+ FPGA family. It has a total of 2104 pins.
The functions of these pins include a variety of I/O capabilities, power, ground connections, and dedicated configuration and clock pins. Specifically, the pins can be configured for user-defined I/O standards, supporting various protocols and interfaces such as LVDS, PCIe, and Ethernet. Additionally, it has dedicated pins for configuration and management functions, including JTAG, and multi-gigabit transceivers (MGTs) for high-speed data transmission. The FPGA can also interface with memory and other peripherals through its programmable I/O resources.

Manufacturer

The manufacturer of the XCVU13P-2FHGA2104I is Xilinx, Inc. Xilinx is a semiconductor company known for designing and producing programmable logic devices, including Field Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and system-on-chip (SoC) solutions. Founded in 1984, Xilinx pioneered the FPGA technology and has established itself as a leader in the industry, providing versatile solutions for a wide range of applications, including telecommunications, automotive, aerospace, and data centers. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further enhancing its capabilities in the semiconductor market.

Application

The XCVU13P-2FHGA2104I is a high-performance FPGA from Xilinx's UltraScale+ series, suitable for various applications including data centers, high-performance computing, machine learning, video processing, and telecommunications. It excels in tasks like real-time analytics, network acceleration, and digital signal processing (DSP), making it ideal for AI inference, 5G infrastructure, and video transcoding. Its versatility enables it to support both edge and cloud computing environments.

Equivalent

The XCVU13P-2FHGA2104I is a part of the Xilinx Virtex UltraScale+ series. Equivalent products include the XCVU13P-2FLGA2104I and XCVU13P-2FFG2104I, which offer similar performance and features but may differ in packaging and specific configurations. For precise compatibility, consult Xilinx's product documentation or comparison tools.

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