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XCVU13P-2FLGA2577I
IC FPGA 448 I/O 2577FCBGA
- Hersteller
- Fr. Teil #XCVU13P-2FLGA2577I
- Paket FBGA-2577
- Datenblatt
- Auf Lager4448
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Spezifikationen
| Package | Tray |
| Series | Virtex® UltraScale+™ |
| ProductStatus | Active |
| NumberofLABs/CLBs | 216000 |
| NumberofLogicElements/Cells | 3780000 |
| TotalRAMBits | 514867200 |
| NumberofI/O | 448 |
| Voltage-Supply | 0.825V ~ 0.876V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 2577-BBGA, FCBGA |
Übersicht
Description
With a capacity of 3.8 million logic cells and support for various interfaces, including PCIe and Ethernet, the XCVU13P is suited for complex algorithms and real-time processing. It offers advanced power management features and can be programmed using VHDL, Verilog, or high-level synthesis tools, making it versatile for engineers. Designed for scalability and integration, this FPGA is a key component in modern computing and telecommunications infrastructures.
Features
1. Architecture: Utilizes the UltraScale+ architecture for high performance and efficiency.
2. Logic Cells: Contains 1,000,000+ logic cells, supporting complex designs.
3. DSP Slices: Equipped with numerous DSP slices for high-speed arithmetic operations.
4. Memory: Supports multiple types of memory blocks, including Block RAM (BRAM) and UltraRAM.
5. I/O: Offers a diverse set of I/O capabilities, including high-speed transceivers for communication.
6. Power Efficiency: Designed for low power consumption while maintaining high performance.
7. Advanced Features: Supports advanced features like partial reconfiguration and integrated SERDES.
8. Application Areas: Ideal for data center, high-performance computing, and telecommunications applications.
This FPGA is known for its flexibility, scalability, and ability to handle demanding workloads efficiently.
Package
Pinout
It supports multiple I/O standards, enabling flexibility in interfacing with different components. The architecture is optimized for demanding applications in fields like telecommunications, data centers, and high-performance computing. The "2" in the designation indicates the speed grade, while "FLGA" refers to its package type, which is a flip-chip ball grid array.
Overall, the XCVU13P-2FLGA2577I is suited for complex digital designs requiring significant processing power and connectivity options.
Manufacturer
Application
Equivalent
Versand
VersandmethodenWir
bieten Sie globale Versanddienstleistungen durch DHL, FedEx, TNT, UPS oder einen anderen Spediteur Ihrer Wahl.
Versandgebührenreferenz (DHL/FedEx):
DHL: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 2-5 Werktagen.
von FedEx: Versandkosten reichen von $25-$40 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
UPS: Versandkosten reichen von $25-$45 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
TNT: Versandkosten reichen von $25-$65 (0.5kg), mit einer geschätzten Lieferzeit von 3-7 Werktagen.
EMS: Versandkosten reichen von $30-$50 (0.5kg), mit einer geschätzten Lieferzeit von 7-15 Werktagen.
Registrierte Luftpost: Versandkosten sind $ 2- $ 4 (0,1 kg), mit einer geschätzten Lieferzeit von 5-20 Werktagen.
Zahlungen
Payment Methods
Die Zahlungsfrist ist 100% Prepaid.
Derzeit akzeptieren wir nur die folgenden Zahlungsmethoden:
1. PayPal
2. Kredit- / Debitkarte
3. Überweisung
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